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制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
M2GL090TS-1FGG676I

M2GL090TS-1FGG676I

IC FPGA 425 I/O 676FBGA

Microchip Technology

3,475 253.26
M2GL090TS-1FGG676I

数据手册

IGLOO2 676-BGA Tray Active Not Verified - 86316 2648064 425 - 1.14V ~ 2.625V Surface Mount -40°C ~ 100°C (TJ) - - 676-FBGA (27x27)
M1A3P1000-1FG144M

M1A3P1000-1FG144M

IC FPGA 97 I/O 144FBGA

Microchip Technology

1,280 239.36
M1A3P1000-1FG144M

数据手册

ProASIC3 144-LBGA Tray Active Not Verified - - 147456 97 1000000 1.425V ~ 1.575V Surface Mount -55°C ~ 125°C (TJ) - - 144-FPBGA (13x13)
M1A3P1000-1FGG144M

M1A3P1000-1FGG144M

IC FPGA 97 I/O 144FBGA

Microchip Technology

1,171 239.36
M1A3P1000-1FGG144M

数据手册

ProASIC3 144-LBGA Tray Active Not Verified - - 147456 97 1000000 1.425V ~ 1.575V Surface Mount -55°C ~ 125°C (TJ) - - 144-FPBGA (13x13)
A3P1000-1FG144M

A3P1000-1FG144M

IC FPGA 97 I/O 144FBGA

Microchip Technology

1,014 239.36
A3P1000-1FG144M

数据手册

ProASIC3 144-LBGA Tray Active Not Verified - - 147456 97 1000000 1.425V ~ 1.575V Surface Mount -55°C ~ 125°C (TJ) - - 144-FPBGA (13x13)
A3P1000-1FGG144M

A3P1000-1FGG144M

IC FPGA 97 I/O 144FBGA

Microchip Technology

4,561 239.36
A3P1000-1FGG144M

数据手册

ProASIC3 144-LBGA Tray Active Not Verified - - 147456 97 1000000 1.425V ~ 1.575V Surface Mount -55°C ~ 125°C (TJ) - - 144-FPBGA (13x13)
A42MX16-PQG208A

A42MX16-PQG208A

IC FPGA 140 I/O 208QFP

Microchip Technology

3,753 245.35
A42MX16-PQG208A

数据手册

MX 208-BFQFP Tray Active Not Verified - - - 140 24000 3V ~ 3.6V, 4.5V ~ 5.5V Surface Mount -40°C ~ 125°C (TA) - - 208-PQFP (28x28)
A42MX16-1PQG160I

A42MX16-1PQG160I

IC FPGA 125 I/O 160QFP

Microchip Technology

3,241 241.35
A42MX16-1PQG160I

数据手册

MX 160-BQFP Tray Active Not Verified - - - 125 24000 3V ~ 3.6V, 4.5V ~ 5.5V Surface Mount -40°C ~ 85°C (TA) - - 160-PQFP (28x28)
A42MX16-2TQG176

A42MX16-2TQG176

IC FPGA 140 I/O 176TQFP

Microchip Technology

2,780 242.71
A42MX16-2TQG176

数据手册

MX 176-LQFP Tray Active Not Verified - - - 140 24000 3V ~ 3.6V, 4.75V ~ 5.25V Surface Mount 0°C ~ 70°C (TA) - - 176-TQFP (24x24)
A54SX32A-FG256A

A54SX32A-FG256A

IC FPGA 203 I/O 256FBGA

Microchip Technology

3,234 247.31
A54SX32A-FG256A

数据手册

SX-A 256-BGA Tray Active Not Verified 2880 - - 203 48000 2.25V ~ 5.25V Surface Mount -40°C ~ 125°C (TA) - - 256-FPBGA (17x17)
A54SX32A-FGG256A

A54SX32A-FGG256A

IC FPGA 203 I/O 256FBGA

Microchip Technology

4,705 247.31
A54SX32A-FGG256A

数据手册

SX-A 256-BGA Tray Active Not Verified 2880 - - 203 48000 2.25V ~ 5.25V Surface Mount -40°C ~ 125°C (TA) - - 256-FPBGA (17x17)