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制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
M1A3PE3000L-FG484M

M1A3PE3000L-FG484M

IC FPGA 341 I/O 484FBGA

Microchip Technology

1,038 1563.11
M1A3PE3000L-FG484M

数据手册

ProASIC3L 484-BGA Tray Active Not Verified - - 516096 341 3000000 1.425V ~ 1.575V Surface Mount -55°C ~ 125°C (TJ) - - 484-FPBGA (23x23)
M1A3PE3000L-FGG484M

M1A3PE3000L-FGG484M

IC FPGA 341 I/O 484FBGA

Microchip Technology

1,414 1563.11
M1A3PE3000L-FGG484M

数据手册

ProASIC3L 484-BGA Tray Active Not Verified - - 516096 341 3000000 1.425V ~ 1.575V Surface Mount -55°C ~ 125°C (TJ) - - 484-FPBGA (23x23)
A3PE3000L-FG484M

A3PE3000L-FG484M

IC FPGA 341 I/O 484FBGA

Microchip Technology

2,957 1563.11
A3PE3000L-FG484M

数据手册

ProASIC3L 484-BGA Tray Active Not Verified - - 516096 341 3000000 1.425V ~ 1.575V Surface Mount -55°C ~ 125°C (TJ) - - 484-FPBGA (23x23)
A3PE3000L-FGG484M

A3PE3000L-FGG484M

IC FPGA 341 I/O 484FBGA

Microchip Technology

1,543 1563.11
A3PE3000L-FGG484M

数据手册

ProASIC3L 484-BGA Tray Active Not Verified - - 516096 341 3000000 1.425V ~ 1.575V Surface Mount -55°C ~ 125°C (TJ) - - 484-FPBGA (23x23)
AX250-1FG484M

AX250-1FG484M

IC FPGA 248 I/O 484FBGA

Microchip Technology

3,875 1615.92
AX250-1FG484M

数据手册

Axcelerator 484-BGA Tray Active Not Verified 4224 - 55296 248 250000 1.425V ~ 1.575V Surface Mount -55°C ~ 125°C (TA) - - 484-FPBGA (23x23)
AX250-1FGG484M

AX250-1FGG484M

IC FPGA 248 I/O 484FBGA

Microchip Technology

4,730 1615.92
AX250-1FGG484M

数据手册

Axcelerator 484-BGA Tray Active Not Verified 4224 - 55296 248 250000 1.425V ~ 1.575V Surface Mount -55°C ~ 125°C (TA) - - 484-FPBGA (23x23)
M1A3PE3000L-FG896M

M1A3PE3000L-FG896M

IC FPGA 620 I/O 896FBGA

Microchip Technology

3,302 1693.88
M1A3PE3000L-FG896M

数据手册

ProASIC3L 896-BGA Tray Active Not Verified - - 516096 620 3000000 1.425V ~ 1.575V Surface Mount -55°C ~ 125°C (TJ) - - 896-FBGA (31x31)
AX2000-2FG896

AX2000-2FG896

IC FPGA 586 I/O 896FBGA

Microchip Technology

3,641 1702.62
AX2000-2FG896

数据手册

Axcelerator 896-BGA Tray Active Not Verified 32256 - 294912 586 2000000 1.425V ~ 1.575V Surface Mount 0°C ~ 70°C (TA) - - 896-FBGA (31x31)
AX2000-2FGG896

AX2000-2FGG896

IC FPGA 586 I/O 896FBGA

Microchip Technology

2,852 1702.62
AX2000-2FGG896

数据手册

Axcelerator 896-BGA Tray Active Not Verified 32256 - 294912 586 2000000 1.425V ~ 1.575V Surface Mount 0°C ~ 70°C (TA) - - 896-FBGA (31x31)
M1A3PE3000L-1FGG484M

M1A3PE3000L-1FGG484M

IC FPGA 341 I/O 484FBGA

Microchip Technology

4,598 1719.43
M1A3PE3000L-1FGG484M

数据手册

ProASIC3L 484-BGA Tray Active Not Verified - - 516096 341 3000000 1.425V ~ 1.575V Surface Mount -55°C ~ 125°C (TJ) - - 484-FPBGA (23x23)