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制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
M2GL005S-1VFG400

M2GL005S-1VFG400

IC FPGA 169 I/O 400VFBGA

Microchip Technology

4,505 17.90
M2GL005S-1VFG400

数据手册

IGLOO2 400-LFBGA Tray Active Not Verified - 6060 719872 169 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 400-VFBGA (17x17)
M2GL005S-VF400I

M2GL005S-VF400I

IC FPGA 169 I/O 400VFBGA

Microchip Technology

4,137 17.90
M2GL005S-VF400I

数据手册

IGLOO2 400-LFBGA Tray Active Not Verified - 6060 719872 169 - 1.14V ~ 2.625V Surface Mount -40°C ~ 100°C (TJ) - - 400-VFBGA (17x17)
M2GL005S-VFG400I

M2GL005S-VFG400I

IC FPGA 169 I/O 400VFBGA

Microchip Technology

2,173 17.90
M2GL005S-VFG400I

数据手册

IGLOO2 400-LFBGA Tray Active Not Verified - 6060 719872 169 - 1.14V ~ 2.625V Surface Mount -40°C ~ 100°C (TJ) - - 400-VFBGA (17x17)
M2GL005-1FG484

M2GL005-1FG484

IC FPGA 209 I/O 484FBGA

Microchip Technology

1,454 17.92
M2GL005-1FG484

数据手册

IGLOO2 484-BGA Tray Active Not Verified - 6060 719872 209 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)
M2GL005-1FGG484

M2GL005-1FGG484

IC FPGA 209 I/O 484FBGA

Microchip Technology

3,750 17.92
M2GL005-1FGG484

数据手册

IGLOO2 484-BGA Tray Active Not Verified - 6060 719872 209 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)
M2GL005-FG484I

M2GL005-FG484I

IC FPGA 209 I/O 484FBGA

Microchip Technology

1,389 17.92
M2GL005-FG484I

数据手册

IGLOO2 484-BGA Tray Active Not Verified - 6060 719872 209 - 1.14V ~ 2.625V Surface Mount -40°C ~ 100°C (TJ) - - 484-FPBGA (23x23)
AT40K20AL-1FQC

AT40K20AL-1FQC

IC FPGA 256 I/O 304PQFP

Microchip Technology

2,821 -
AT40K20AL-1FQC

数据手册

AT40KAL 304-BFQFP Tray Obsolete Not Verified - 1024 8192 256 30000 3V ~ 3.6V Surface Mount 0°C ~ 70°C - - 304-PQFP (40x40)
A3P125-2FGG144I

A3P125-2FGG144I

IC FPGA 97 I/O 144FBGA

Microchip Technology

3,549 16.96
A3P125-2FGG144I

数据手册

ProASIC3 144-LBGA Tray Active Not Verified - - 36864 97 125000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 144-FPBGA (13x13)
A3P125-2FG144I

A3P125-2FG144I

IC FPGA 97 I/O 144FBGA

Microchip Technology

4,283 16.96
A3P125-2FG144I

数据手册

ProASIC3 144-LBGA Tray Active Not Verified - - 36864 97 125000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 144-FPBGA (13x13)
A3P125-2PQG208

A3P125-2PQG208

IC FPGA 133 I/O 208QFP

Microchip Technology

1,335 17.10
A3P125-2PQG208

数据手册

ProASIC3 208-BFQFP Tray Active Not Verified - - 36864 133 125000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 208-PQFP (28x28)