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制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
M1A3P600-1PQG208I

M1A3P600-1PQG208I

IC FPGA 154 I/O 208QFP

Microchip Technology

2,738 58.56
M1A3P600-1PQG208I

数据手册

ProASIC3 208-BFQFP Tray Active Not Verified - - 110592 154 600000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 208-PQFP (28x28)
A3P600-1PQG208I

A3P600-1PQG208I

IC FPGA 154 I/O 208QFP

Microchip Technology

2,910 58.56
A3P600-1PQG208I

数据手册

ProASIC3 208-BFQFP Tray Active Not Verified - - 110592 154 600000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 208-PQFP (28x28)
M2GL025T-FG484

M2GL025T-FG484

IC FPGA 267 I/O 484FBGA

Microchip Technology

1,540 62.97
M2GL025T-FG484

数据手册

IGLOO2 484-BGA Tray Active Not Verified - 27696 1130496 267 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)
M2GL025T-1VF256

M2GL025T-1VF256

IC FPGA 138 I/O 256FBGA

Microchip Technology

4,400 65.86
M2GL025T-1VF256

数据手册

IGLOO2 256-LFBGA Tray Active Not Verified - 27696 1130496 138 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 256-FPBGA (14x14)
M2GL025T-1VFG256

M2GL025T-1VFG256

IC FPGA 138 I/O 256FBGA

Microchip Technology

1,344 65.86
M2GL025T-1VFG256

数据手册

IGLOO2 256-LFBGA Tray Active Not Verified - 27696 1130496 138 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 256-FPBGA (14x14)
M2GL025TS-VF256

M2GL025TS-VF256

IC FPGA 138 I/O 256FBGA

Microchip Technology

4,520 65.86
M2GL025TS-VF256

数据手册

IGLOO2 256-LFBGA Tray Active Not Verified - 27696 1130496 138 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 256-FPBGA (14x14)
M2GL025TS-VFG256

M2GL025TS-VFG256

IC FPGA 138 I/O 256FBGA

Microchip Technology

1,570 65.86
M2GL025TS-VFG256

数据手册

IGLOO2 256-LFBGA Tray Active Not Verified - 27696 1130496 138 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 256-FPBGA (14x14)
M2GL025T-VFG256I

M2GL025T-VFG256I

IC FPGA 138 I/O 256FBGA

Microchip Technology

1,289 65.86
M2GL025T-VFG256I

数据手册

IGLOO2 256-LFBGA Tray Active Not Verified - 27696 1130496 138 - 1.14V ~ 2.625V Surface Mount -40°C ~ 100°C (TJ) - - 256-FPBGA (14x14)
M2GL025T-1VF400

M2GL025T-1VF400

IC FPGA 207 I/O 400VFBGA

Microchip Technology

2,673 64.24
M2GL025T-1VF400

数据手册

IGLOO2 400-LFBGA Tray Active Not Verified - 27696 1130496 207 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 400-VFBGA (17x17)
M2GL025T-1VFG400

M2GL025T-1VFG400

IC FPGA 207 I/O 400VFBGA

Microchip Technology

3,886 64.24
M2GL025T-1VFG400

数据手册

IGLOO2 400-LFBGA Tray Active Not Verified - 27696 1130496 207 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 400-VFBGA (17x17)