产品中心

制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
M2GL025TS-1FCSG325

M2GL025TS-1FCSG325

IC FPGA 180 I/O 324CSBGA

Microchip Technology

1,963 60.55
M2GL025TS-1FCSG325

数据手册

IGLOO2 325-TFBGA, FCBGA Tray Active Not Verified - 27696 1130496 180 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 325-FCBGA (11x11)
M2GL025TS-FCS325I

M2GL025TS-FCS325I

IC FPGA 180 I/O 325BGA

Microchip Technology

2,595 60.55
M2GL025TS-FCS325I

数据手册

IGLOO2 325-TFBGA, FCBGA Tray Active Not Verified - 27696 1130496 180 - 1.14V ~ 2.625V Surface Mount -40°C ~ 100°C (TJ) - - 325-FCBGA (11x11)
M2GL025TS-FCSG325I

M2GL025TS-FCSG325I

IC FPGA 180 I/O 324CSBGA

Microchip Technology

2,089 60.55
M2GL025TS-FCSG325I

数据手册

IGLOO2 325-TFBGA, FCBGA Tray Active Not Verified - 27696 1130496 180 - 1.14V ~ 2.625V Surface Mount -40°C ~ 100°C (TJ) - - 325-FCBGA (11x11)
M2GL025-1VF256

M2GL025-1VF256

IC FPGA 138 I/O 256FBGA

Microchip Technology

1,658 60.58
M2GL025-1VF256

数据手册

IGLOO2 256-LFBGA Tray Active Not Verified - 27696 1130496 138 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 256-FPBGA (14x14)
M2GL025-1VFG256

M2GL025-1VFG256

IC FPGA 138 I/O 256FBGA

Microchip Technology

1,025 60.58
M2GL025-1VFG256

数据手册

IGLOO2 256-LFBGA Tray Active Not Verified - 27696 1130496 138 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 256-FPBGA (14x14)
M2GL025-VF256I

M2GL025-VF256I

IC FPGA 138 I/O 256FBGA

Microchip Technology

3,151 60.58
M2GL025-VF256I

数据手册

IGLOO2 256-LFBGA Tray Active Not Verified - 27696 1130496 138 - 1.14V ~ 2.625V Surface Mount -40°C ~ 100°C (TJ) - - 256-FPBGA (14x14)
M2GL025-VFG256I

M2GL025-VFG256I

IC FPGA 138 I/O 256FBGA

Microchip Technology

3,681 60.58
M2GL025-VFG256I

数据手册

IGLOO2 256-LFBGA Tray Active Not Verified - 27696 1130496 138 - 1.14V ~ 2.625V Surface Mount -40°C ~ 100°C (TJ) - - 256-FPBGA (14x14)
M2GL025-1VF400

M2GL025-1VF400

IC FPGA 207 I/O 400VFBGA

Microchip Technology

1,698 59.09
M2GL025-1VF400

数据手册

IGLOO2 400-LFBGA Tray Active Not Verified - 27696 1130496 207 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 400-VFBGA (17x17)
M2GL025-1VFG400

M2GL025-1VFG400

IC FPGA 207 I/O 400VFBGA

Microchip Technology

4,363 59.09
M2GL025-1VFG400

数据手册

IGLOO2 400-LFBGA Tray Active Not Verified - 27696 1130496 207 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 400-VFBGA (17x17)
M1A3P600-2FGG144I

M1A3P600-2FGG144I

IC FPGA 97 I/O 144FBGA

Microchip Technology

2,426 56.50
M1A3P600-2FGG144I

数据手册

ProASIC3 144-LBGA Tray Active Not Verified - - 110592 97 600000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 144-FPBGA (13x13)
M1A3P600-2FG144I

M1A3P600-2FG144I

IC FPGA 97 I/O 144FBGA

Microchip Technology

3,611 56.50
M1A3P600-2FG144I

数据手册

ProASIC3 144-LBGA Tray Active Not Verified - - 110592 97 600000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 144-FPBGA (13x13)
M1A3P600-FG484

M1A3P600-FG484

IC FPGA 235 I/O 484FBGA

Microchip Technology

2,911 56.54
M1A3P600-FG484

数据手册

ProASIC3 484-BGA Tray Active Not Verified - - 110592 235 600000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)
M1A3P600-FGG484

M1A3P600-FGG484

IC FPGA 235 I/O 484FBGA

Microchip Technology

1,912 56.54
M1A3P600-FGG484

数据手册

ProASIC3 484-BGA Tray Active Not Verified - - 110592 235 600000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)
A54SX08A-FTQG144

A54SX08A-FTQG144

IC FPGA 113 I/O 144TQFP

Microchip Technology

3,676 57.38
A54SX08A-FTQG144

数据手册

SX-A 144-LQFP Tray Active Not Verified 768 - - 113 12000 2.25V ~ 5.25V Surface Mount 0°C ~ 70°C (TA) - - 144-TQFP (20x20)
A3P600-1FGG256I

A3P600-1FGG256I

IC FPGA 177 I/O 256FBGA

Microchip Technology

2,272 57.78
A3P600-1FGG256I

数据手册

ProASIC3 256-LBGA Tray Active Not Verified - - 110592 177 600000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 256-FPBGA (17x17)
M1A3P600-1FGG256I

M1A3P600-1FGG256I

IC FPGA 177 I/O 256FBGA

Microchip Technology

2,783 57.78
M1A3P600-1FGG256I

数据手册

ProASIC3 256-LBGA Tray Active Not Verified - - 110592 177 600000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 256-FPBGA (17x17)
M1A3P600-1FG256I

M1A3P600-1FG256I

IC FPGA 177 I/O 256FBGA

Microchip Technology

2,100 57.78
M1A3P600-1FG256I

数据手册

ProASIC3 256-LBGA Tray Active Not Verified - - 110592 177 600000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 256-FPBGA (17x17)
A3P600-1FG256I

A3P600-1FG256I

IC FPGA 177 I/O 256FBGA

Microchip Technology

1,149 57.78
A3P600-1FG256I

数据手册

ProASIC3 256-LBGA Tray Active Not Verified - - 110592 177 600000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 256-FPBGA (17x17)
AGL400V5-FGG256I

AGL400V5-FGG256I

IC FPGA 178 I/O 256FBGA

Microchip Technology

2,858 -
AGL400V5-FGG256I

数据手册

IGLOO 256-LBGA Tray Active Not Verified - 9216 55296 178 400000 1.425V ~ 1.575V Surface Mount -40°C ~ 85°C (TA) - - 256-FPBGA (17x17)
M1A3P600-1PQG208I

M1A3P600-1PQG208I

IC FPGA 154 I/O 208QFP

Microchip Technology

2,738 58.56
M1A3P600-1PQG208I

数据手册

ProASIC3 208-BFQFP Tray Active Not Verified - - 110592 154 600000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 208-PQFP (28x28)