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制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
M2GL060-FGG484

M2GL060-FGG484

IC FPGA 267 I/O 484FBGA

Microchip Technology

2,416 87.52
M2GL060-FGG484

数据手册

IGLOO2 484-BGA Tray Active Not Verified - 56520 1869824 267 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)
A40MX02-2PLG68I

A40MX02-2PLG68I

IC FPGA 57 I/O 68PLCC

Microchip Technology

4,335 83.22
A40MX02-2PLG68I

数据手册

MX 68-LCC (J-Lead) Tray Active Not Verified - - - 57 3000 3V ~ 3.6V, 4.5V ~ 5.5V Surface Mount -40°C ~ 85°C (TA) - - 68-PLCC (24.23x24.23)
A40MX04-1PLG84

A40MX04-1PLG84

IC FPGA 69 I/O 84PLCC

Microchip Technology

1,986 83.52
A40MX04-1PLG84

数据手册

MX 84-LCC (J-Lead) Tray Last Time Buy Not Verified - - - 69 6000 3V ~ 3.6V, 4.75V ~ 5.25V Surface Mount 0°C ~ 70°C (TA) - - 84-PLCC (29.31x29.31)
A40MX02-2PQG100

A40MX02-2PQG100

IC FPGA 57 I/O 100QFP

Microchip Technology

1,707 83.52
A40MX02-2PQG100

数据手册

MX 100-BQFP Tray Active Not Verified - - - 57 3000 3V ~ 3.6V, 4.75V ~ 5.25V Surface Mount 0°C ~ 70°C (TA) - - 100-PQFP (20x14)
M1AGL600V5-FG144I

M1AGL600V5-FG144I

IC FPGA 97 I/O 144FBGA

Microchip Technology

4,215 84.30
M1AGL600V5-FG144I

数据手册

IGLOO 144-LBGA Tray Active Not Verified - 13824 110592 97 600000 1.425V ~ 1.575V Surface Mount -40°C ~ 85°C (TA) - - 144-FPBGA (13x13)
M1AGL600V5-FGG144I

M1AGL600V5-FGG144I

IC FPGA 97 I/O 144FBGA

Microchip Technology

4,116 84.30
M1AGL600V5-FGG144I

数据手册

IGLOO 144-LBGA Tray Active Not Verified - 13824 110592 97 600000 1.425V ~ 1.575V Surface Mount -40°C ~ 85°C (TA) - - 144-FPBGA (13x13)
A3P1000-2FGG256

A3P1000-2FGG256

IC FPGA 177 I/O 256FBGA

Microchip Technology

2,936 83.43
A3P1000-2FGG256

数据手册

ProASIC3 256-LBGA Tray Active Not Verified - - 147456 177 1000000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 256-FPBGA (17x17)
A3P1000-2FG256

A3P1000-2FG256

IC FPGA 177 I/O 256FBGA

Microchip Technology

1,333 83.43
A3P1000-2FG256

数据手册

ProASIC3 256-LBGA Tray Active Not Verified - - 147456 177 1000000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 256-FPBGA (17x17)
M1A3P1000-2FG256

M1A3P1000-2FG256

IC FPGA 177 I/O 256FBGA

Microchip Technology

4,858 83.43

-

ProASIC3 256-LBGA Tray Active Not Verified - - 147456 177 1000000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 256-FPBGA (17x17)
M1A3P1000-2FGG256

M1A3P1000-2FGG256

IC FPGA 177 I/O 256FBGA

Microchip Technology

3,292 83.43

-

ProASIC3 256-LBGA Tray Active Not Verified - - 147456 177 1000000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 256-FPBGA (17x17)
M2GL025TS-1FG484I

M2GL025TS-1FG484I

IC FPGA 267 I/O 484FBGA

Microchip Technology

4,589 88.74
M2GL025TS-1FG484I

数据手册

IGLOO2 484-BGA Tray Active Not Verified - 27696 1130496 267 - 1.14V ~ 2.625V Surface Mount -40°C ~ 100°C (TJ) - - 484-FPBGA (23x23)
M2GL025TS-1FGG484I

M2GL025TS-1FGG484I

IC FPGA 267 I/O 484FBGA

Microchip Technology

2,127 88.74
M2GL025TS-1FGG484I

数据手册

IGLOO2 484-BGA Tray Active Not Verified - 27696 1130496 267 - 1.14V ~ 2.625V Surface Mount -40°C ~ 100°C (TJ) - - 484-FPBGA (23x23)
M1A3P600L-1FGG484

M1A3P600L-1FGG484

IC FPGA 235 I/O 484FBGA

Microchip Technology

3,964 83.78
M1A3P600L-1FGG484

数据手册

ProASIC3L 484-BGA Tray Active Not Verified - - 110592 235 600000 1.14V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)
A3P600L-1FG484

A3P600L-1FG484

IC FPGA 235 I/O 484FBGA

Microchip Technology

3,212 83.78
A3P600L-1FG484

数据手册

ProASIC3L 484-BGA Tray Active Not Verified - - 110592 235 600000 1.14V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)
M1A3P600L-1FG484

M1A3P600L-1FG484

IC FPGA 235 I/O 484FBGA

Microchip Technology

3,167 83.78
M1A3P600L-1FG484

数据手册

ProASIC3L 484-BGA Tray Active Not Verified - - 110592 235 600000 1.14V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)
M1A3P1000-PQG208I

M1A3P1000-PQG208I

IC FPGA 154 I/O 208QFP

Microchip Technology

2,349 84.40

-

ProASIC3 208-BFQFP Tray Active Not Verified - - 147456 154 1000000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 208-PQFP (28x28)
M2GL050T-1FCS325I

M2GL050T-1FCS325I

IC FPGA 200 I/O 325BGA

Microchip Technology

3,548 93.69
M2GL050T-1FCS325I

数据手册

IGLOO2 325-TFBGA, FCBGA Tray Active Not Verified - 56340 1869824 200 - 1.14V ~ 2.625V Surface Mount -40°C ~ 100°C (TJ) - - 325-FCBGA (11x11)
M2GL050T-1FCSG325I

M2GL050T-1FCSG325I

IC FPGA 200 I/O 324CSBGA

Microchip Technology

1,153 93.69
M2GL050T-1FCSG325I

数据手册

IGLOO2 325-TFBGA, FCBGA Tray Active Not Verified - 56340 1869824 200 - 1.14V ~ 2.625V Surface Mount -40°C ~ 100°C (TJ) - - 325-FCBGA (11x11)
M2GL050TS-1FCS325

M2GL050TS-1FCS325

IC FPGA 200 I/O 325BGA

Microchip Technology

2,123 93.69
M2GL050TS-1FCS325

数据手册

IGLOO2 325-TFBGA, FCBGA Tray Active Not Verified - 56340 1869824 200 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 325-FCBGA (11x11)
M2GL050TS-1FCSG325

M2GL050TS-1FCSG325

IC FPGA 200 I/O 324CSBGA

Microchip Technology

2,155 93.69
M2GL050TS-1FCSG325

数据手册

IGLOO2 325-TFBGA, FCBGA Tray Active Not Verified - 56340 1869824 200 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 325-FCBGA (11x11)