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制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
M2GL050TS-VFG400I

M2GL050TS-VFG400I

IC FPGA 207 I/O 400VFBGA

Microchip Technology

2,482 111.38
M2GL050TS-VFG400I

数据手册

IGLOO2 400-LFBGA Tray Active Not Verified - 56340 1869824 207 - 1.14V ~ 2.625V Surface Mount -40°C ~ 100°C (TJ) - - 400-VFBGA (17x17)
A40MX04-2PLG84I

A40MX04-2PLG84I

IC FPGA 69 I/O 84PLCC

Microchip Technology

3,591 105.78
A40MX04-2PLG84I

数据手册

MX 84-LCC (J-Lead) Tray Last Time Buy Not Verified - - - 69 6000 3V ~ 3.6V, 4.5V ~ 5.5V Surface Mount -40°C ~ 85°C (TA) - - 84-PLCC (29.31x29.31)
A54SX16A-1TQG144

A54SX16A-1TQG144

IC FPGA 113 I/O 144TQFP

Microchip Technology

1,091 105.98
A54SX16A-1TQG144

数据手册

SX-A 144-LQFP Tray Active Not Verified 1452 - - 113 24000 2.25V ~ 5.25V Surface Mount 0°C ~ 70°C (TA) - - 144-TQFP (20x20)
A54SX16A-1TQG100

A54SX16A-1TQG100

IC FPGA 81 I/O 100TQFP

Microchip Technology

3,471 105.98
A54SX16A-1TQG100

数据手册

SX-A 100-LQFP Tray Active Not Verified 1452 - - 81 24000 2.25V ~ 5.25V Surface Mount 0°C ~ 70°C (TA) - - 100-TQFP (14x14)
M1AFS250-2FGG256

M1AFS250-2FGG256

IC FPGA 114 I/O 256FBGA

Microchip Technology

1,083 107.56
M1AFS250-2FGG256

数据手册

Fusion® 256-LBGA Tray Active Not Verified - - 36864 114 250000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 256-FPBGA (17x17)
AFS250-2FG256

AFS250-2FG256

IC FPGA 114 I/O 256FBGA

Microchip Technology

2,003 107.56
AFS250-2FG256

数据手册

Fusion® 256-LBGA Tray Active Not Verified - - 36864 114 250000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 256-FPBGA (17x17)
M1AFS250-2FG256

M1AFS250-2FG256

IC FPGA 114 I/O 256FBGA

Microchip Technology

1,768 107.56
M1AFS250-2FG256

数据手册

Fusion® 256-LBGA Tray Active Not Verified - - 36864 114 250000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 256-FPBGA (17x17)
AFS250-2FGG256

AFS250-2FGG256

IC FPGA 114 I/O 256FBGA

Microchip Technology

1,831 107.56
AFS250-2FGG256

数据手册

Fusion® 256-LBGA Tray Active Not Verified - - 36864 114 250000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 256-FPBGA (17x17)
A40MX04-2VQG80

A40MX04-2VQG80

IC FPGA 69 I/O 80VQFP

Microchip Technology

2,852 106.10
A40MX04-2VQG80

数据手册

MX 80-TQFP Tray Active Not Verified - - - 69 6000 3V ~ 3.6V, 4.75V ~ 5.25V Surface Mount 0°C ~ 70°C (TA) - - 80-VQFP (14x14)
A40MX02-3PLG44I

A40MX02-3PLG44I

IC FPGA 34 I/O 44PLCC

Microchip Technology

1,589 106.75
A40MX02-3PLG44I

数据手册

MX 44-LCC (J-Lead) Tray Active Not Verified - - - 34 3000 3V ~ 3.6V, 4.5V ~ 5.5V Surface Mount -40°C ~ 85°C (TA) - - 44-PLCC (16.59x16.59)
M2GL060-1FG484I

M2GL060-1FG484I

IC FPGA 267 I/O 484FBGA

Microchip Technology

1,993 113.75
M2GL060-1FG484I

数据手册

IGLOO2 484-BGA Tray Active Not Verified - 56520 1869824 267 - 1.14V ~ 2.625V Surface Mount -40°C ~ 100°C (TJ) - - 484-FPBGA (23x23)
M2GL060-1FGG484I

M2GL060-1FGG484I

IC FPGA 267 I/O 484FBGA

Microchip Technology

2,891 113.75
M2GL060-1FGG484I

数据手册

IGLOO2 484-BGA Tray Active Not Verified - 56520 1869824 267 - 1.14V ~ 2.625V Surface Mount -40°C ~ 100°C (TJ) - - 484-FPBGA (23x23)
A54SX08A-2TQG144

A54SX08A-2TQG144

IC FPGA 113 I/O 144TQFP

Microchip Technology

3,478 107.75
A54SX08A-2TQG144

数据手册

SX-A 144-LQFP Tray Active Not Verified 768 - - 113 12000 2.25V ~ 5.25V Surface Mount 0°C ~ 70°C (TA) - - 144-TQFP (20x20)
A54SX08A-1TQG144I

A54SX08A-1TQG144I

IC FPGA 113 I/O 144TQFP

Microchip Technology

3,718 107.75
A54SX08A-1TQG144I

数据手册

SX-A 144-LQFP Tray Active Not Verified 768 - - 113 12000 2.25V ~ 5.25V Surface Mount -40°C ~ 85°C (TA) - - 144-TQFP (20x20)
A54SX08A-2TQG100I

A54SX08A-2TQG100I

IC FPGA 81 I/O 100TQFP

Microchip Technology

3,156 107.75
A54SX08A-2TQG100I

数据手册

SX-A 100-LQFP Tray Active Not Verified 768 - - 81 12000 2.25V ~ 5.25V Surface Mount -40°C ~ 85°C (TA) - - 100-TQFP (14x14)
M2GL060T-1FG676

M2GL060T-1FG676

IC FPGA 387 I/O 676FBGA

Microchip Technology

1,923 114.90
M2GL060T-1FG676

数据手册

IGLOO2 676-BGA Tray Active Not Verified - 56520 1869824 387 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 676-FBGA (27x27)
M2GL060T-1FGG676

M2GL060T-1FGG676

IC FPGA 387 I/O 676FBGA

Microchip Technology

2,176 114.90
M2GL060T-1FGG676

数据手册

IGLOO2 676-BGA Tray Active Not Verified - 56520 1869824 387 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 676-FBGA (27x27)
M2GL060T-FG676I

M2GL060T-FG676I

IC FPGA 387 I/O 676FBGA

Microchip Technology

4,113 114.90
M2GL060T-FG676I

数据手册

IGLOO2 676-BGA Tray Active Not Verified - 56520 1869824 387 - 1.14V ~ 2.625V Surface Mount -40°C ~ 100°C (TJ) - - 676-FBGA (27x27)
M2GL060TS-FG676

M2GL060TS-FG676

IC FPGA 387 I/O 676FBGA

Microchip Technology

1,036 114.90
M2GL060TS-FG676

数据手册

IGLOO2 676-BGA Tray Active Not Verified - 56520 1869824 387 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 676-FBGA (27x27)
M2GL060TS-FGG676

M2GL060TS-FGG676

IC FPGA 387 I/O 676FBGA

Microchip Technology

3,840 114.90
M2GL060TS-FGG676

数据手册

IGLOO2 676-BGA Tray Active Not Verified - 56520 1869824 387 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 676-FBGA (27x27)