| 图片 | 制造商型号 | 库存情况 | 价格 | 库存 | 数据手册 | 封装/外壳 | 系列 | 包装 | 产品状态 | 可编程 | 核心处理器 | 核心大小 | 速度 | 连接性 | 外设 | I/O 数量 | 程序存储器大小 | 程序存储器类型 | EEPROM 大小 | RAM 大小 | 电压 - 供应（Vcc/Vdd） | 数据转换器 | 振荡器类型 | 工作温度 | 等级 | 认证 | 安装类型 | 供应商设备封装 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
MC908QB8CDWEIC MCU 8BIT 8KB FLASH 16SOIC NXP USA Inc. |
180 | 6.36 |
|
数据手册 |
16-SOIC (0.295", 7.50mm Width) | HC08 | Tube | Not For New Designs | Not Verified | HC08 | 8-Bit | 8MHz | SCI, SPI | LVD, POR, PWM | 13 | 8KB (8K x 8) | FLASH | - | 256 x 8 | 2.7V ~ 5.5V | A/D 10x10b | Internal | -40°C ~ 85°C (TA) | - | - | Surface Mount | |
|
S9S12G96F0CLFRIC MCU 16BIT 96KB FLASH 48LQFP NXP USA Inc. |
9,990 | 5.83 |
|
数据手册 |
48-LQFP | HCS12 | Tape & Reel (TR) | Active | Not Verified | 12V1 | 16-Bit | 25MHz | CANbus, IrDA, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 40 | 96KB (96K x 8) | FLASH | 3K x 8 | 8K x 8 | 3.13V ~ 5.5V | A/D 12x10b | Internal | -40°C ~ 85°C (TA) | - | - | Surface Mount | |
|
LPC54102J256BD64QLIC MCU 32BIT 256KB FLASH 64LQFP NXP USA Inc. |
588 | 8.58 |
|
数据手册 |
64-LQFP | LPC54100 | Tray | Active | Not Verified | ARM® Cortex®-M4/M0+ | 32-Bit Dual-Core | 100MHz | I2C, SPI, UART/USART | Brown-out Detect/Reset, POR, PWM, WDT | 50 | 256KB (256K x 8) | FLASH | - | 104K x 8 | 1.62V ~ 3.6V | A/D 12x12b | Internal | -40°C ~ 105°C (TA) | - | - | Surface Mount | |
|
MK10DN128VFM5IC MCU 32BIT 128KB FLASH 32QFN NXP USA Inc. |
4,370 | 6.46 |
|
数据手册 |
32-VFQFN Exposed Pad | Kinetis K10 | Tray | Active | Not Verified | ARM® Cortex®-M4 | 32-Bit Single-Core | 50MHz | I2C, IrDA, SPI, UART/USART | DMA, I2S, LVD, POR, PWM, WDT | 24 | 128KB (128K x 8) | FLASH | - | 16K x 8 | 1.71V ~ 3.6V | A/D 10x16b | Internal | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | |
|
|
MKL43Z256VLH4IC MCU 32BIT 256KB FLASH 64LQFP NXP USA Inc. |
2,239 | 7.52 |
|
数据手册 |
64-LQFP | Kinetis KL4 | Tray | Active | Not Verified | ARM® Cortex®-M0+ | 32-Bit Single-Core | 48MHz | I2C, SPI, UART/USART, USB | DMA, I2S, LCD, LVD, POR, PWM, WDT | 50 | 256KB (256K x 8) | FLASH | - | 32K x 8 | 1.71V ~ 3.6V | A/D 16x16b; D/A 1x12b | Internal | -40°C ~ 105°C (TA) | - | - | Surface Mount | |
|
MC9S08AW48CFUEIC MCU 8BIT 48KB FLASH 64QFP NXP USA Inc. |
969 | 6.80 |
|
数据手册 |
64-QFP | S08 | Tray | Active | Not Verified | S08 | 8-Bit | 40MHz | I2C, SCI, SPI | LVD, POR, PWM, WDT | 54 | 48KB (48K x 8) | FLASH | - | 2K x 8 | 2.7V ~ 5.5V | A/D 16x10b | Internal | -40°C ~ 85°C (TA) | - | - | Surface Mount | |
|
|
MKL27Z128VLH4IC MCU 32BIT 128KB FLASH 64LQFP NXP USA Inc. |
800 | 6.66 |
|
数据手册 |
64-LQFP | Kinetis KL2 | Tray | Active | Not Verified | ARM® Cortex®-M0+ | 32-Bit Single-Core | 48MHz | I2C, SPI, UART/USART, USB | DMA, I2S, LVD, POR, PWM, WDT | 50 | 128KB (128K x 8) | FLASH | - | 32K x 8 | 1.71V ~ 3.6V | A/D 16x16b; D/A 1x12b | Internal | -40°C ~ 105°C (TA) | - | - | Surface Mount | |
|
S9S12P32J0VFTRIC MCU 16BIT 32KB FLASH 48QFN NXP USA Inc. |
2,000 | 6.11 |
|
数据手册 |
48-TFQFN Exposed Pad | HCS12 | Tape & Reel (TR) | Active | Not Verified | HCS12 | 16-Bit | 32MHz | CANbus, SCI, SPI | LVD, POR, PWM, WDT | 34 | 32KB (32K x 8) | FLASH | 4K x 8 | 2K x 8 | 1.72V ~ 5.5V | A/D 10x12b | Internal | -40°C ~ 105°C (TA) | - | - | Surface Mount | |
|
MC9S08QE32CFTIC MCU 8BIT 32KB FLASH 48QFN NXP USA Inc. |
1,523 | 3.67 |
|
数据手册 |
48-VFQFN Exposed Pad | S08 | Tray | Active | Not Verified | S08 | 8-Bit | 50MHz | I2C, LINbus, SCI, SPI | LVD, PWM, WDT | 38 | 32KB (32K x 8) | FLASH | - | 2K x 8 | 1.8V ~ 3.6V | A/D 10x12b | Internal | -40°C ~ 85°C (TA) | - | - | Surface Mount | |
|
|
MC9S08AW16CFUEIC MCU 8BIT 16KB FLASH 64QFP NXP USA Inc. |
178 | 9.01 |
|
数据手册 |
64-QFP | S08 | Tray | Active | Not Verified | S08 | 8-Bit | 40MHz | I2C, SCI, SPI | LVD, POR, PWM, WDT | 54 | 16KB (16K x 8) | FLASH | - | 1K x 8 | 2.7V ~ 5.5V | A/D 16x10b | Internal | -40°C ~ 85°C (TA) | - | - | Surface Mount |
