| 图片 | 制造商型号 | 库存情况 | 价格 | 库存 | 数据手册 | 封装/外壳 | 系列 | 包装 | 产品状态 | 可编程 | 核心处理器 | 核心大小 | 速度 | 连接性 | 外设 | I/O 数量 | 程序存储器大小 | 程序存储器类型 | EEPROM 大小 | RAM 大小 | 电压 - 供应（Vcc/Vdd） | 数据转换器 | 振荡器类型 | 工作温度 | 等级 | 认证 | 安装类型 | 供应商设备封装 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
LPC55S69JEV98YIC MCU 32BIT 640KB FLASH NXP USA Inc. |
1,376 | - |
|
数据手册 |
98-VFBGA | LPC55S6x | Tape & Reel (TR) | Active | - | ARM® Cortex®-M33 | 32-Bit Dual-Core | 150MHz | Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB | Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT | 64 | 640KB (640K x 8) | FLASH | - | 320K x 8 | 1.8V ~ 3.6V | A/D 10x16b SAR | Internal | -40°C ~ 105°C (TA) | - | - | Surface Mount | |
|
|
LPC55S69JEV98EIC MCU 32BIT 640KB FLASH NXP USA Inc. |
260 | - |
|
数据手册 |
98-VFBGA | LPC55S6x | Tray | Active | - | ARM® Cortex®-M33 | 32-Bit Dual-Core | 150MHz | Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB | Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT | 64 | 640KB (640K x 8) | FLASH | - | 320K x 8 | 1.8V ~ 3.6V | A/D 10x16b SAR | Internal | -40°C ~ 105°C (TA) | - | - | Surface Mount | |
|
MKM34Z128ACLL5IC MCU 32BIT 128KB FLASH 100LQFP NXP USA Inc. |
450 | 3.25 |
|
数据手册 |
100-LQFP | Kinetis KM | Tray | Active | Not Verified | ARM® Cortex®-M0+ | 32-Bit Single-Core | 50MHz | I2C, SPI, UART/USART | DMA, LCD, WDT | 68 | 128KB (128K x 8) | FLASH | - | 16K x 8 | 1.71V ~ 3.6V | A/D 12x16b, 4x24b | Internal | -40°C ~ 85°C (TA) | - | - | Surface Mount | |
|
|
MIMXRT1021DAF5BIC MCU 32BIT EXT MEM 100LQFP NXP USA Inc. |
279 | - |
|
数据手册 |
100-LQFP | RT1020 | Tray | Active | Not Verified | ARM® Cortex®-M7 | 32-Bit Single-Core | 500MHz | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG | Brown-out Detect/Reset, DMA, POR, PWM, WDT | 57 | - | External Program Memory | - | 256K x 8 | 3V ~ 3.6V | A/D 10x12b | External, Internal | 0°C ~ 95°C (TJ) | - | - | Surface Mount | |
|
FS32K142HFT0VLHTIC MCU 32BIT 256KB FLASH 64LQFP NXP USA Inc. |
136 | 23.10 |
|
数据手册 |
64-LQFP | S32K | Tray | Active | Not Verified | ARM® Cortex®-M4F | 32-Bit Single-Core | 80MHz | CANbus, FlexIO, I2C, LINbus, SPI, UART/USART | POR, PWM, WDT | 58 | 256KB (256K x 8) | FLASH | 4K x 8 | 32K x 8 | 2.7V ~ 5.5V | A/D 16x12b SAR; D/A1x8b | Internal | -40°C ~ 105°C (TA) | - | - | Surface Mount | |
|
LPC55S36JHI48MPIC MCU 32BIT 256KB FLSH 48HVQFN NXP USA Inc. |
3,994 | - |
|
数据手册 |
48-VFQFN Exposed Pad | - | Tape & Reel (TR) | Active | - | ARM® Cortex®-M33 | 32-Bit Single-Core | 150MHz | CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART | Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT | 32 | 256KB (256K x 8) | FLASH | - | 128K x 8 | 1.8V ~ 3.6V | A/D 10x16b | External, Internal | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | |
|
|
LPC55S36JHI48KIC MCU 32BIT 256KB FLSH 48HVQFN NXP USA Inc. |
1,280 | - |
|
数据手册 |
48-VFQFN Exposed Pad | - | Tray | Active | - | ARM® Cortex®-M33 | 32-Bit Single-Core | 150MHz | CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART | Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT | 32 | 256KB (256K x 8) | FLASH | - | 128K x 8 | 1.8V ~ 3.6V | A/D 10x16b | External, Internal | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | |
|
LPC5536JBD64MPIC MCU 32BIT 256KB FLASH 64TQFP NXP USA Inc. |
1,494 | - |
|
数据手册 |
64-TQFP Exposed Pad | - | Tape & Reel (TR) | Active | - | ARM® Cortex®-M33 | 32-Bit Single-Core | 150MHz | CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART | Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT | 39 | 256KB (256K x 8) | FLASH | - | 128K x 8 | 1.8V ~ 3.6V | A/D 13x16b; D/A 1x12b | External, Internal | -40°C ~ 105°C (TA) | - | - | Surface Mount | |
|
|
MIMXRT1041DFP6BRIC MCU 32BIT 128KB ROM 169LFBGA NXP USA Inc. |
1,950 | - |
|
数据手册 |
169-LFBGA | RT1040 | Tape & Reel (TR) | Active | - | ARM® Cortex®-M7 | 32-Bit Single-Core | 600MHz | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG | Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT | 114 | 128KB (128K x 8) | ROM | - | 512K x 8 | 3V ~ 3.6V | A/D 12x12b | External, Internal | 0°C ~ 90°C (TJ) | - | - | Surface Mount | |
|
|
LPC5534JBD100MPIC MCU 32BIT 128KB FLSH 100HLQFP NXP USA Inc. |
980 | - |
|
数据手册 |
100-LQFP Exposed Pad | - | Tape & Reel (TR) | Active | - | ARM® Cortex®-M33 | 32-Bit Single-Core | 150MHz | CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART, USB2.0 | Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT | 66 | 128KB (128K x 8) | FLASH | - | 96K x 8 | 1.8V ~ 3.6V | A/D 23x16b; D/A 2x12b | External, Internal | -40°C ~ 105°C (TA) | - | - | Surface Mount |
