产品中心

制造商 系列 封装/外壳 包装 产品状态 应用 电流 - 电源 电压 - 电源 工作温度 等级 认证 安装类型 供应商设备封装
































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 应用 电流 - 电源 电压 - 电源 工作温度 等级 认证 安装类型 供应商设备封装
MFS8412AMBP7ES

MFS8412AMBP7ES

SAFETY POWER MANAGEMENT IC, QFN4

NXP USA Inc.

4,638 -
MFS8412AMBP7ES

数据手册

- 48-VFQFN Exposed Pad Tray Active System Basis Chip 15mA 60V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount, Wettable Flank 48-HVQFN (7x7)
MC35FS6508NAER2

MC35FS6508NAER2

SYSTEM BASIS CHIP, DCDC 0.8A VCO

NXP USA Inc.

2,724 -
MC35FS6508NAER2

数据手册

- 48-LQFP Exposed Pad Tape & Reel (TR) Active System Basis Chip - 1V ~ 5V -40°C ~ 150°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7)
MC35FS6507NAE

MC35FS6507NAE

SYSTEM BASIS CHIP, DCDC 0.8A VCO

NXP USA Inc.

4,342 -
MC35FS6507NAE

数据手册

- 48-LQFP Exposed Pad Tray Active System Basis Chip - 1V ~ 5V -40°C ~ 150°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7)
MC33FS8510A2ESR2

MC33FS8510A2ESR2

SYSTEM BASIS CHIP FS8500

NXP USA Inc.

4,539 5.25

-

* - Tape & Reel (TR) Active - - - - - - - -
MC33FS8510B6ESR2

MC33FS8510B6ESR2

FS8500

NXP USA Inc.

4,672 5.25

-

- - Tape & Reel (TR) Active - - - - - - - -
MC33FS8510D3ESR2

MC33FS8510D3ESR2

FS8510

NXP USA Inc.

4,742 5.25

-

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active Power Supplies - 60V -40°C ~ 125°C (TA) Automotive - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC35FS6501CAER2

MC35FS6501CAER2

FS6500

NXP USA Inc.

4,242 5.46
MC35FS6501CAER2

数据手册

- 48-LQFP Exposed Pad Tape & Reel (TR) Active System Basis Chip - 1V ~ 5V -40°C ~ 150°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7)
MC33FS6512LAE

MC33FS6512LAE

SYSTEM BASIS CHIP DCDC 1.5A VCO

NXP USA Inc.

2,132 5.46
MC33FS6512LAE

数据手册

- 48-LQFP Exposed Pad Tray Active System Basis Chip - 1V ~ 5V -40°C ~ 125°C - - Surface Mount 48-HLQFP (7x7)
MC34PF8100A0EP

MC34PF8100A0EP

IC POWER MANAGEMENT

NXP USA Inc.

4,932 6.85
MC34PF8100A0EP

数据手册

- 56-VFQFN Exposed Pad Tray Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount 56-HVQFN (8x8)
MC34PF8100CHEP

MC34PF8100CHEP

IC POWER MANAGEMENT I.MX8QM

NXP USA Inc.

1,264 5.12
MC34PF8100CHEP

数据手册

- 56-VFQFN Exposed Pad Tray Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount 56-HVQFN (8x8)