产品中心

制造商 系列 封装/外壳 包装 产品状态 应用 电流 - 电源 电压 - 电源 工作温度 等级 认证 安装类型 供应商设备封装
































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 应用 电流 - 电源 电压 - 电源 工作温度 等级 认证 安装类型 供应商设备封装
MC33FS6600M2ESR2

MC33FS6600M2ESR2

SAFETY SBC FOR S32S2 MCU

NXP USA Inc.

2,583 6.10

-

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active Safety - 2.7V ~ 60V -40°C ~ 125°C (TA) Automotive - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33PF8200CXES

MC33PF8200CXES

IC POWER MANAGEMENT LS1043A

NXP USA Inc.

4,422 6.66
MC33PF8200CXES

数据手册

- 56-VFQFN Exposed Pad Tray Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33PF8200D2ES

MC33PF8200D2ES

IC POWER MANAGEMENT

NXP USA Inc.

1,363 6.66
MC33PF8200D2ES

数据手册

- 56-VFQFN Exposed Pad Tray Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33PF8200DBES

MC33PF8200DBES

IC POWER MANAGEMENT I.MX8QM

NXP USA Inc.

4,551 7.52
MC33PF8200DBES

数据手册

- 56-VFQFN Exposed Pad Tray Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33PF8200DFES

MC33PF8200DFES

I.MX8QXP WITH DDR3L

NXP USA Inc.

1,666 6.66
MC33PF8200DFES

数据手册

- 56-VFQFN Exposed Pad Tray Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33PF8200DHES

MC33PF8200DHES

IC POWER MANAGEMENT I.MX8QM

NXP USA Inc.

1,678 6.66
MC33PF8200DHES

数据手册

- 56-VFQFN Exposed Pad Tray Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33PF8200ESES

MC33PF8200ESES

IC POWER MANAGEMENT I.MX8QM

NXP USA Inc.

2,394 7.66
MC33PF8200ESES

数据手册

- 56-VFQFN Exposed Pad Tray Active High Performance i.MX 8, S32x Processor Based - 2.7V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33PF8200ETES

MC33PF8200ETES

IC POWER MANAGEMENT I.MX8QM

NXP USA Inc.

1,934 6.66
MC33PF8200ETES

数据手册

- 56-VFQFN Exposed Pad Tray Active High Performance i.MX 8, S32x Processor Based - 2.7V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33PF8200DMES

MC33PF8200DMES

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.

1,489 6.66
MC33PF8200DMES

数据手册

- 56-VFQFN Exposed Pad Tray Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33PF8200DNES

MC33PF8200DNES

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.

4,646 6.66
MC33PF8200DNES

数据手册

- 56-VFQFN Exposed Pad Tray Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)