产品中心

制造商 系列 封装/外壳 包装 产品状态 应用 电流 - 电源 电压 - 电源 工作温度 等级 认证 安装类型 供应商设备封装
































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 应用 电流 - 电源 电压 - 电源 工作温度 等级 认证 安装类型 供应商设备封装
MC35FS6508CAE

MC35FS6508CAE

SYSTEM BASIS CHIP, DCDC 0.8A VCO

NXP USA Inc.

250 -
MC35FS6508CAE

数据手册

- 48-LQFP Exposed Pad Tray Active System Basis Chip - 1V ~ 5V -40°C ~ 150°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7)
MC35FS6518CAE

MC35FS6518CAE

SYSTEM BASIS CHIP, DCDC 1.5A VCO

NXP USA Inc.

250 -
MC35FS6518CAE

数据手册

- 48-LQFP Exposed Pad Tray Active System Basis Chip - 1V ~ 5V -40°C ~ 150°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7)
MC33PF8100FJES

MC33PF8100FJES

POWER MANAGEMENT IC, I.MX8, PRE-

NXP USA Inc.

210 -
MC33PF8100FJES

数据手册

- 56-VFQFN Exposed Pad Tray Active Processor 10µA 2.5V ~ 5.5V -40°C ~ 105°C (TA) Automotive AEC-Q100 Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33814AER2

MC33814AER2

IC CTRL SMALL ENG 2CYL 48LQFP

NXP USA Inc.

1,990 4.37
MC33814AER2

数据手册

- 48-LQFP Exposed Pad Tape & Reel (TR) Active Small Engine 10mA 4.5V ~ 36V -40°C ~ 125°C - - Surface Mount 48-LQFP-EP (7x7)
MC33PF8100EPES

MC33PF8100EPES

IC POWER MANAGEMENT I.MX8QM

NXP USA Inc.

201 6.98
MC33PF8100EPES

数据手册

- 56-VFQFN Exposed Pad Tray Active High Performance i.MX 8, S32x Processor Based - 2.7V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33PF8100EQES

MC33PF8100EQES

IC POWER MANAGEMENT I.MX8QM

NXP USA Inc.

104 6.98
MC33PF8100EQES

数据手册

- 56-VFQFN Exposed Pad Tray Active High Performance i.MX 8, S32x Processor Based - 2.7V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC35FS6503CAE

MC35FS6503CAE

FS6500

NXP USA Inc.

250 6.94
MC35FS6503CAE

数据手册

- 48-LQFP Exposed Pad Tray Active System Basis Chip - 1V ~ 5V -40°C ~ 150°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7)
MWCT1013AVLH

MWCT1013AVLH

15W MULTI-COIL AUTO PREMIUM L

NXP USA Inc.

800 0.80

-

- 64-LQFP Tray Active - - 2.7V ~ 3.6V -40°C ~ 105°C (TA) Automotive AEC-Q100 Surface Mount 64-LQFP (10x10)
PCA9420FUKZ

PCA9420FUKZ

PCA9420FUK

NXP USA Inc.

3,000 -

-

- 25-UFBGA, WLCSP Tape & Reel (TR) Active - 4.5µA 3.3V ~ 5.5V -40°C ~ 85°C (TA) - - Surface Mount 25-WLCSP (2.09x2.09)
MWCT1200CFM

MWCT1200CFM

IC MULTI COIL 5W 5V 32QFN

NXP USA Inc.

4,746 1.98

-

- 32-VFQFN Exposed Pad Tray Not For New Designs Wireless Power Transmitter 300µA 2.7V ~ 3.6V -40°C ~ 85°C - - Surface Mount, Wettable Flank 32-HVQFN (5x5)