产品中心

制造商 系列 封装/外壳 包装 产品状态 应用 电流 - 电源 电压 - 电源 工作温度 等级 认证 安装类型 供应商设备封装
































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 应用 电流 - 电源 电压 - 电源 工作温度 等级 认证 安装类型 供应商设备封装
MC34708VM

MC34708VM

IC POWER MANAGEMENT 206MAPBGA

NXP USA Inc.

740 11.98
MC34708VM

数据手册

- 206-LFBGA Tray Active General Purpose - 1.8V ~ 4.5V -40°C ~ 85°C - - Surface Mount 206-MAPBGA (13x13)
PCA9420BSAZ

PCA9420BSAZ

PCA9420BS

NXP USA Inc.

1,317 -
PCA9420BSAZ

数据手册

- 24-VFQFN Exposed Pad Tape & Reel (TR) Active - 4.5µA 3.3V ~ 5.5V -40°C ~ 85°C (TA) - - Surface Mount 24-HVQFN (3x3)
TEA2206T/1J

TEA2206T/1J

IC ACTIVE BRIDGE CTRL SO8

NXP USA Inc.

4,622 4.48
TEA2206T/1J

数据手册

- 8-SOIC (0.154", 3.90mm Width) Tape & Reel (TR) Active Desktop, Notebook PCs 2mA 440V -40°C ~ 125°C (TJ) - - Surface Mount 8-SO
MC32PF4210A1ES

MC32PF4210A1ES

PF4210

NXP USA Inc.

266 6.90
MC32PF4210A1ES

数据手册

- 56-VFQFN Exposed Pad Tray Active Audio, Video - 2.8V ~ 4.5V 0°C ~ 85°C (TA) - - Surface Mount, Wettable Flank 56-QFN-EP (8x8)
MFS2303BMBA3EP

MFS2303BMBA3EP

MFS2303BMBA3EP

NXP USA Inc.

531 -
MFS2303BMBA3EP

数据手册

- 48-VFQFN Exposed Pad Tray Active System Basis Chip 40µA 5.5V ~ 40V -40°C ~ 125°C (TA) - - Surface Mount, Wettable Flank 48-HVQFN (7x7)
TEA2208T/1J

TEA2208T/1J

BRIDGE RECTIFIER CONTROLLER S014

NXP USA Inc.

2,518 5.74
TEA2208T/1J

数据手册

- 14-SOIC (0.154", 3.90mm Width) Tape & Reel (TR) Active Desktop, Notebook PCs 2mA 0V ~ 440V -40°C ~ 125°C (TJ) - - Surface Mount 14-SO
MC34704AEP

MC34704AEP

IC POWER MANAGEMENT 56-QFN

NXP USA Inc.

1,758 0.80
MC34704AEP

数据手册

- 56-VFQFN Exposed Pad Tray Active Processor 86mA 2.7V ~ 5.5V -20°C ~ 85°C - - Surface Mount 56-QFN-EP (7x7)
MC33FS4500CAE

MC33FS4500CAE

SYSTEM BASIS CHIP LINEAR 0.5A V

NXP USA Inc.

161 6.75
MC33FS4500CAE

数据手册

- 48-LQFP Exposed Pad Tray Active System Basis Chip - 1V ~ 5V -40°C ~ 125°C - - Surface Mount 48-HLQFP (7x7)
MC33664ATL1EGR2

MC33664ATL1EGR2

TRANSFORMER PHYSICAL LAYER

NXP USA Inc.

1,893 4.42
MC33664ATL1EGR2

数据手册

- 16-SOIC (0.154", 3.90mm Width) Tape & Reel (TR) Active Isolated Communications Interface 40mA 4.5V ~ 5.5V -40°C ~ 125°C (TA) - - Surface Mount 16-SOIC
MFS2613AMDA4AD

MFS2613AMDA4AD

SAFETY SYSTEM BASIS CHIP WITH LO

NXP USA Inc.

198 -
MFS2613AMDA4AD

数据手册

- 48-LQFP Exposed Pad Tray Active - - 3.2V ~ 40V -40°C ~ 125°C (TA) Automotive - Surface Mount 48-LQFP-EP (7x7)