产品中心

制造商 系列 封装/外壳 包装 产品状态 应用 电流 - 电源 电压 - 电源 工作温度 等级 认证 安装类型 供应商设备封装
































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 应用 电流 - 电源 电压 - 电源 工作温度 等级 认证 安装类型 供应商设备封装
MFS2603AMBA0ADR2

MFS2603AMBA0ADR2

SAFETY SYSTEM BASIS CHIP WITH LO

NXP USA Inc.

1,716 -
MFS2603AMBA0ADR2

数据手册

- 48-LQFP Exposed Pad Tape & Reel (TR) Active - - 3.2V ~ 40V -40°C ~ 125°C (TA) Automotive - Surface Mount 48-LQFP-EP (7x7)
MC33FS6520CAER2

MC33FS6520CAER2

SYSTEM BASIS CHIP DCDC 2.2A VCO

NXP USA Inc.

1,052 4.39
MC33FS6520CAER2

数据手册

- 48-LQFP Exposed Pad Tape & Reel (TR) Active System Basis Chip - 1V ~ 5V -40°C ~ 125°C - - Surface Mount 48-HLQFP (7x7)
MFS8601BMDA0ESR2

MFS8601BMDA0ESR2

SAFETY SYSTEM BASIS CHIP FOR DOM

NXP USA Inc.

1,827 -
MFS8601BMDA0ESR2

数据手册

- 48-VFQFN Exposed Pad Tape & Reel (TR) Active Camera - 60V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount, Wettable Flank 48-HVQFN (7x7)
MC33FS8400G5ES

MC33FS8400G5ES

SYSTEM BASIS CHIP FS8400

NXP USA Inc.

1,155 4.18

-

* - Tray Active - - - - - - - -
MC34PF8101A0EPR2

MC34PF8101A0EPR2

POWER MANAGEMENT IC I.MX8 NON-PR

NXP USA Inc.

2,267 5.06

-

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8 Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33FS4501NAE

MC33FS4501NAE

SYSTEM BASIS CHIP LINEAR 0.5A V

NXP USA Inc.

1,858 4.41
MC33FS4501NAE

数据手册

- 48-LQFP Exposed Pad Tray Active System Basis Chip - 1V ~ 5V -40°C ~ 125°C - - Surface Mount 48-HLQFP (7x7)
MC33FS4506CAER2

MC33FS4506CAER2

SYSTEM BASIS CHIP, LINEAR 0.5A V

NXP USA Inc.

1,493 -
MC33FS4506CAER2

数据手册

- 48-LQFP Exposed Pad Tape & Reel (TR) Active System Basis Chip - 1V ~ 5V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7)
MC33FS6517NAER2

MC33FS6517NAER2

SYSTEM BASIS CHIP, DCDC 1.5A VCO

NXP USA Inc.

4,892 -
MC33FS6517NAER2

数据手册

- 48-LQFP Exposed Pad Tape & Reel (TR) Active System Basis Chip - 1V ~ 5V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7)
MFS8602BMBA0ES

MFS8602BMBA0ES

IC FS86 SYSTEM BASIS CHIP ASIL

NXP USA Inc.

4,283 4.20

-

- 48-VFQFN Exposed Pad Tray Active Camera - 4.5V ~ 60V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount 48-QFN (7x7)
MC34PF3000A4EP

MC34PF3000A4EP

IC POWER MANAGEMENT 48QFN

NXP USA Inc.

2,183 4.59
MC34PF3000A4EP

数据手册

- 48-VFQFN Exposed Pad Tray Active i.MX Processors - 2.8V ~ 5.5V -40°C ~ 105°C - - Surface Mount 48-HVQFN (7x7)