图片 | 制造商型号 | 库存情况 | 价格 | 库存 | 数据手册 | 系列 | 封装/外壳 | 包装 | 产品状态 | 应用 | 电流 - 电源 | 电压 - 电源 | 工作温度 | 等级 | 认证 | 安装类型 | 供应商设备封装 |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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MC35FS4505NAESYSTEM BASIS CHIP, LINEAR 0.5A V NXP USA Inc. |
4,170 | - |
|
![]() 数据手册 |
- | 48-LQFP Exposed Pad | Tray | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 150°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) |
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MC33FS6506NAESYSTEM BASIS CHIP, DCDC 0.8A VCO NXP USA Inc. |
2,678 | - |
|
![]() 数据手册 |
- | 48-LQFP Exposed Pad | Tray | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) |
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MFS8633BMDA0ESR2SAFETY SYSTEM BASIS CHIP FOR DOM NXP USA Inc. |
2,371 | - |
|
![]() 数据手册 |
- | 48-VFQFN Exposed Pad | Tape & Reel (TR) | Active | Camera | - | 36V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 48-HVQFN (7x7) |
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MC33FS6517KAER2SYSTEM BASIS CHIP, DCDC 1.5A VCO NXP USA Inc. |
3,212 | - |
|
![]() 数据手册 |
- | 48-LQFP Exposed Pad | Tape & Reel (TR) | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) |
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MC33FS4507CAER2SYSTEM BASIS CHIP, LINEAR 0.5A V NXP USA Inc. |
3,947 | - |
|
![]() 数据手册 |
- | 48-LQFP Exposed Pad | Tape & Reel (TR) | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) |
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MC32PF1550A3EPR2POWER MANAGEMENT IC: 3 BUCK REGS NXP USA Inc. |
3,003 | 0.80 |
|
![]() 数据手册 |
- | 40-VFQFN Exposed Pad | Tape & Reel (TR) | Active | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | - | 3.8V ~ 7V | -40°C ~ 85°C | - | - | Surface Mount | 40-HVQFN (5x5) |
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MPF7100BMMA0ESR2POWER MANAGEMENT IC, I.MX 8, I.M NXP USA Inc. |
4,036 | - |
|
![]() 数据手册 |
- | 48-VFQFN Exposed Pad | Tape & Reel (TR) | Active | i.MX Processors | 10µA | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 48-HVQFN (7x7) |
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MPF7100BVBA0ESR2POWER MANAGEMENT IC, I.MX 8, I.M NXP USA Inc. |
2,168 | - |
|
![]() 数据手册 |
- | 48-VFQFN Exposed Pad | Tape & Reel (TR) | Active | i.MX Processors | 10µA | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 48-HVQFN (7x7) |
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MPF7100BVBA4ESR2POWER MANAGEMENT IC, I.MX 8DX/8D NXP USA Inc. |
1,734 | - |
|
![]() 数据手册 |
- | 48-VFQFN Exposed Pad | Tape & Reel (TR) | Active | i.MX Processors | 10µA | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 48-HVQFN (7x7) |
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MPF7100BVBA2ESR2POWER MANAGEMENT IC, I.MX 8XL WI NXP USA Inc. |
1,166 | - |
|
![]() 数据手册 |
- | 48-VFQFN Exposed Pad | Tape & Reel (TR) | Active | i.MX Processors | 10µA | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 48-HVQFN (7x7) |