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制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
M2GL050-FG896I

M2GL050-FG896I

IC FPGA 377 I/O 896FBGA

Microchip Technology

3,837 116.28
M2GL050-FG896I

数据手册

IGLOO2 896-BGA Tray Active Not Verified - 56340 1869824 377 - 1.14V ~ 2.625V Surface Mount -40°C ~ 100°C (TJ) - - 896-FBGA (31x31)
A42MX16-FPQG160

A42MX16-FPQG160

IC FPGA 125 I/O 160QFP

Microchip Technology

4,675 110.40
A42MX16-FPQG160

数据手册

MX 160-BQFP Tray Active Not Verified - - - 125 24000 3V ~ 3.6V, 4.75V ~ 5.25V Surface Mount 0°C ~ 70°C (TA) - - 160-PQFP (28x28)
M2GL050T-1FGG484I

M2GL050T-1FGG484I

IC FPGA 267 I/O 484FBGA

Microchip Technology

2,842 116.68
M2GL050T-1FGG484I

数据手册

IGLOO2 484-BGA Tray Active Not Verified - 56340 1869824 267 - 1.14V ~ 2.625V Surface Mount -40°C ~ 100°C (TJ) - - 484-FPBGA (23x23)
M2GL050TS-1FG484

M2GL050TS-1FG484

IC FPGA 267 I/O 484FBGA

Microchip Technology

1,689 116.68
M2GL050TS-1FG484

数据手册

IGLOO2 484-BGA Tray Active Not Verified - 56340 1869824 267 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)
M2GL050TS-1FGG484

M2GL050TS-1FGG484

IC FPGA 267 I/O 484FBGA

Microchip Technology

2,922 116.68
M2GL050TS-1FGG484

数据手册

IGLOO2 484-BGA Tray Active Not Verified - 56340 1869824 267 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)
M2GL050TS-FG484I

M2GL050TS-FG484I

IC FPGA 267 I/O 484FBGA

Microchip Technology

4,541 116.68
M2GL050TS-FG484I

数据手册

IGLOO2 484-BGA Tray Active Not Verified - 56340 1869824 267 - 1.14V ~ 2.625V Surface Mount -40°C ~ 100°C (TJ) - - 484-FPBGA (23x23)
M2GL050TS-FGG484I

M2GL050TS-FGG484I

IC FPGA 267 I/O 484FBGA

Microchip Technology

4,941 116.68
M2GL050TS-FGG484I

数据手册

IGLOO2 484-BGA Tray Active Not Verified - 56340 1869824 267 - 1.14V ~ 2.625V Surface Mount -40°C ~ 100°C (TJ) - - 484-FPBGA (23x23)
M2GL060T-1VF400I

M2GL060T-1VF400I

IC FPGA 207 I/O 400VFBGA

Microchip Technology

4,729 116.93
M2GL060T-1VF400I

数据手册

IGLOO2 400-LFBGA Tray Active Not Verified - 56520 1869824 207 - 1.14V ~ 2.625V Surface Mount -40°C ~ 100°C (TJ) - - 400-VFBGA (17x17)
M2GL060T-1VFG400I

M2GL060T-1VFG400I

IC FPGA 207 I/O 400VFBGA

Microchip Technology

1,170 116.93
M2GL060T-1VFG400I

数据手册

IGLOO2 400-LFBGA Tray Active Not Verified - 56520 1869824 207 - 1.14V ~ 2.625V Surface Mount -40°C ~ 100°C (TJ) - - 400-VFBGA (17x17)
M2GL060TS-1VF400

M2GL060TS-1VF400

IC FPGA 207 I/O 400VFBGA

Microchip Technology

2,662 116.93
M2GL060TS-1VF400

数据手册

IGLOO2 400-LFBGA Tray Active Not Verified - 56520 1869824 207 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 400-VFBGA (17x17)