产品中心

制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
A40MX02-3PLG44I

A40MX02-3PLG44I

IC FPGA 34 I/O 44PLCC

Microchip Technology

1,589 106.75
A40MX02-3PLG44I

数据手册

MX 44-LCC (J-Lead) Tray Active Not Verified - - - 34 3000 3V ~ 3.6V, 4.5V ~ 5.5V Surface Mount -40°C ~ 85°C (TA) - - 44-PLCC (16.59x16.59)
M2GL060-1FG484I

M2GL060-1FG484I

IC FPGA 267 I/O 484FBGA

Microchip Technology

1,993 113.75
M2GL060-1FG484I

数据手册

IGLOO2 484-BGA Tray Active Not Verified - 56520 1869824 267 - 1.14V ~ 2.625V Surface Mount -40°C ~ 100°C (TJ) - - 484-FPBGA (23x23)
M2GL060-1FGG484I

M2GL060-1FGG484I

IC FPGA 267 I/O 484FBGA

Microchip Technology

2,891 113.75
M2GL060-1FGG484I

数据手册

IGLOO2 484-BGA Tray Active Not Verified - 56520 1869824 267 - 1.14V ~ 2.625V Surface Mount -40°C ~ 100°C (TJ) - - 484-FPBGA (23x23)
A54SX08A-2TQG144

A54SX08A-2TQG144

IC FPGA 113 I/O 144TQFP

Microchip Technology

3,478 107.75
A54SX08A-2TQG144

数据手册

SX-A 144-LQFP Tray Active Not Verified 768 - - 113 12000 2.25V ~ 5.25V Surface Mount 0°C ~ 70°C (TA) - - 144-TQFP (20x20)
A54SX08A-1TQG144I

A54SX08A-1TQG144I

IC FPGA 113 I/O 144TQFP

Microchip Technology

3,718 107.75
A54SX08A-1TQG144I

数据手册

SX-A 144-LQFP Tray Active Not Verified 768 - - 113 12000 2.25V ~ 5.25V Surface Mount -40°C ~ 85°C (TA) - - 144-TQFP (20x20)
A54SX08A-2TQG100I

A54SX08A-2TQG100I

IC FPGA 81 I/O 100TQFP

Microchip Technology

3,156 107.75
A54SX08A-2TQG100I

数据手册

SX-A 100-LQFP Tray Active Not Verified 768 - - 81 12000 2.25V ~ 5.25V Surface Mount -40°C ~ 85°C (TA) - - 100-TQFP (14x14)
M2GL060T-1FG676

M2GL060T-1FG676

IC FPGA 387 I/O 676FBGA

Microchip Technology

1,923 114.90
M2GL060T-1FG676

数据手册

IGLOO2 676-BGA Tray Active Not Verified - 56520 1869824 387 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 676-FBGA (27x27)
M2GL060T-1FGG676

M2GL060T-1FGG676

IC FPGA 387 I/O 676FBGA

Microchip Technology

2,176 114.90
M2GL060T-1FGG676

数据手册

IGLOO2 676-BGA Tray Active Not Verified - 56520 1869824 387 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 676-FBGA (27x27)
M2GL060T-FG676I

M2GL060T-FG676I

IC FPGA 387 I/O 676FBGA

Microchip Technology

4,113 114.90
M2GL060T-FG676I

数据手册

IGLOO2 676-BGA Tray Active Not Verified - 56520 1869824 387 - 1.14V ~ 2.625V Surface Mount -40°C ~ 100°C (TJ) - - 676-FBGA (27x27)
M2GL060TS-FG676

M2GL060TS-FG676

IC FPGA 387 I/O 676FBGA

Microchip Technology

1,036 114.90
M2GL060TS-FG676

数据手册

IGLOO2 676-BGA Tray Active Not Verified - 56520 1869824 387 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 676-FBGA (27x27)