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制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
M2GL060T-1FG484

M2GL060T-1FG484

IC FPGA 267 I/O 484FBGA

Microchip Technology

1,099 109.39
M2GL060T-1FG484

数据手册

IGLOO2 484-BGA Tray Active Not Verified - 56520 1869824 267 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)
M2GL060T-1FGG484

M2GL060T-1FGG484

IC FPGA 267 I/O 484FBGA

Microchip Technology

4,971 109.39
M2GL060T-1FGG484

数据手册

IGLOO2 484-BGA Tray Active Not Verified - 56520 1869824 267 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)
M2GL060T-FG484I

M2GL060T-FG484I

IC FPGA 267 I/O 484FBGA

Microchip Technology

4,560 109.39
M2GL060T-FG484I

数据手册

IGLOO2 484-BGA Tray Active Not Verified - 56520 1869824 267 - 1.14V ~ 2.625V Surface Mount -40°C ~ 100°C (TJ) - - 484-FPBGA (23x23)
M2GL060TS-FG484

M2GL060TS-FG484

IC FPGA 267 I/O 484FBGA

Microchip Technology

2,886 109.39
M2GL060TS-FG484

数据手册

IGLOO2 484-BGA Tray Active Not Verified - 56520 1869824 267 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)
M2GL060TS-FGG484

M2GL060TS-FGG484

IC FPGA 267 I/O 484FBGA

Microchip Technology

3,749 109.39
M2GL060TS-FGG484

数据手册

IGLOO2 484-BGA Tray Active Not Verified - 56520 1869824 267 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)
M1A3P1000L-1FGG256

M1A3P1000L-1FGG256

IC FPGA 177 I/O 256FBGA

Microchip Technology

1,854 104.20
M1A3P1000L-1FGG256

数据手册

ProASIC3L 256-LBGA Tray Active Not Verified - - 147456 177 1000000 1.14V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 256-FPBGA (17x17)
A3P1000L-1FG256

A3P1000L-1FG256

IC FPGA 177 I/O 256FBGA

Microchip Technology

3,718 104.20
A3P1000L-1FG256

数据手册

ProASIC3L 256-LBGA Tray Active Not Verified - - 147456 177 1000000 1.14V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 256-FPBGA (17x17)
M1A3P1000L-1FG256

M1A3P1000L-1FG256

IC FPGA 177 I/O 256FBGA

Microchip Technology

4,028 104.20
M1A3P1000L-1FG256

数据手册

ProASIC3L 256-LBGA Tray Active Not Verified - - 147456 177 1000000 1.14V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 256-FPBGA (17x17)
A3P1000L-1FGG256

A3P1000L-1FGG256

IC FPGA 177 I/O 256FBGA

Microchip Technology

3,987 104.20
A3P1000L-1FGG256

数据手册

ProASIC3L 256-LBGA Tray Active Not Verified - - 147456 177 1000000 1.14V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 256-FPBGA (17x17)
A42MX16-FVQG100

A42MX16-FVQG100

IC FPGA 83 I/O 100VQFP

Microchip Technology

1,077 105.10
A42MX16-FVQG100

数据手册

MX 100-TQFP Tray Active Not Verified - - - 83 24000 3V ~ 3.6V, 4.75V ~ 5.25V Surface Mount 0°C ~ 70°C (TA) - - 100-VQFP (14x14)