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制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
M1AGL600V2-CS281I

M1AGL600V2-CS281I

IC FPGA 215 I/O 281CSP

Microchip Technology

1,397 100.63
M1AGL600V2-CS281I

数据手册

IGLOO 281-TFBGA, CSBGA Tray Active Not Verified - 13824 110592 215 600000 1.14V ~ 1.575V Surface Mount -40°C ~ 85°C (TA) - - 281-CSP (10x10)
M1A3P1000-2PQG208I

M1A3P1000-2PQG208I

IC FPGA 154 I/O 208QFP

Microchip Technology

3,925 99.47

-

ProASIC3 208-BFQFP Tray Active Not Verified - - 147456 154 1000000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 208-PQFP (28x28)
M2GL060-1FG676

M2GL060-1FG676

IC FPGA 387 I/O 676FBGA

Microchip Technology

2,756 105.70
M2GL060-1FG676

数据手册

IGLOO2 676-BGA Tray Active Not Verified - 56520 1869824 387 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 676-FBGA (27x27)
M2GL060-1FGG676

M2GL060-1FGG676

IC FPGA 387 I/O 676FBGA

Microchip Technology

1,005 105.70
M2GL060-1FGG676

数据手册

IGLOO2 676-BGA Tray Active Not Verified - 56520 1869824 387 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 676-FBGA (27x27)
M2GL060-FG676I

M2GL060-FG676I

IC FPGA 387 I/O 676FBGA

Microchip Technology

3,759 105.70
M2GL060-FG676I

数据手册

IGLOO2 676-BGA Tray Active Not Verified - 56520 1869824 387 - 1.14V ~ 2.625V Surface Mount -40°C ~ 100°C (TJ) - - 676-FBGA (27x27)
A3PE600-2FG484I

A3PE600-2FG484I

IC FPGA 270 I/O 484FBGA

Microchip Technology

3,570 99.87
A3PE600-2FG484I

数据手册

ProASIC3E 484-BGA Tray Active Not Verified - - 110592 270 600000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 484-FPBGA (23x23)
A54SX08A-TQG144A

A54SX08A-TQG144A

IC FPGA 113 I/O 144TQFP

Microchip Technology

3,712 102.50
A54SX08A-TQG144A

数据手册

SX-A 144-LQFP Tray Active Not Verified 768 - - 113 12000 2.25V ~ 5.25V Surface Mount -40°C ~ 125°C (TA) - - 144-TQFP (20x20)
M2GL010TS-1FG484M

M2GL010TS-1FG484M

IC FPGA 233 I/O 484FBGA

Microchip Technology

4,318 106.84
M2GL010TS-1FG484M

数据手册

IGLOO2 484-BGA Tray Active Not Verified - 12084 933888 233 - 1.14V ~ 2.625V Surface Mount -55°C ~ 125°C (TJ) - - 484-FPBGA (23x23)
M2GL010TS-1FGG484M

M2GL010TS-1FGG484M

IC FPGA 233 I/O 484FBGA

Microchip Technology

1,455 106.84
M2GL010TS-1FGG484M

数据手册

IGLOO2 484-BGA Tray Active Not Verified - 12084 933888 233 - 1.14V ~ 2.625V Surface Mount -55°C ~ 125°C (TJ) - - 484-FPBGA (23x23)
A42MX09-FTQG176

A42MX09-FTQG176

IC FPGA 104 I/O 176TQFP

Microchip Technology

3,844 101.45
A42MX09-FTQG176

数据手册

MX 176-LQFP Tray Active Not Verified - - - 104 14000 3V ~ 3.6V, 4.75V ~ 5.25V Surface Mount 0°C ~ 70°C (TA) - - 176-TQFP (24x24)