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制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
M2GL050-FGG896

M2GL050-FGG896

IC FPGA 377 I/O 896FBGA

Microchip Technology

2,120 101.11
M2GL050-FGG896

数据手册

IGLOO2 896-BGA Tray Active Not Verified - 56340 1869824 377 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 896-FBGA (31x31)
M2GL050-FG896

M2GL050-FG896

IC FPGA 377 I/O 896FBGA

Microchip Technology

3,187 101.11
M2GL050-FG896

数据手册

IGLOO2 896-BGA Tray Active Not Verified - 56340 1869824 377 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 896-FBGA (31x31)
M1A3P1000-2FGG256I

M1A3P1000-2FGG256I

IC FPGA 177 I/O 256FBGA

Microchip Technology

4,893 95.94

-

ProASIC3 256-LBGA Tray Active Not Verified - - 147456 177 1000000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 256-FPBGA (17x17)
M1A3P1000-2FG256I

M1A3P1000-2FG256I

IC FPGA 177 I/O 256FBGA

Microchip Technology

3,611 95.94

-

ProASIC3 256-LBGA Tray Active Not Verified - - 147456 177 1000000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 256-FPBGA (17x17)
A3P1000-2FGG256I

A3P1000-2FGG256I

IC FPGA 177 I/O 256FBGA

Microchip Technology

2,380 95.94
A3P1000-2FGG256I

数据手册

ProASIC3 256-LBGA Tray Active Not Verified - - 147456 177 1000000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 256-FPBGA (17x17)
A3P1000-2FG484

A3P1000-2FG484

IC FPGA 300 I/O 484FBGA

Microchip Technology

4,188 96.03
A3P1000-2FG484

数据手册

ProASIC3 484-BGA Tray Active Not Verified - - 147456 300 1000000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)
M1A3P1000-2FG484

M1A3P1000-2FG484

IC FPGA 300 I/O 484FBGA

Microchip Technology

3,743 96.03

-

ProASIC3 484-BGA Tray Active Not Verified - - 147456 300 1000000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)
M1A3P1000-2FGG484

M1A3P1000-2FGG484

IC FPGA 300 I/O 484FBGA

Microchip Technology

1,155 96.03

-

ProASIC3 484-BGA Tray Active Not Verified - - 147456 300 1000000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)
A3P1000-2FGG484

A3P1000-2FGG484

IC FPGA 300 I/O 484FBGA

Microchip Technology

1,543 96.03
A3P1000-2FGG484

数据手册

ProASIC3 484-BGA Tray Active Not Verified - - 147456 300 1000000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)
A40MX02-3PLG44

A40MX02-3PLG44

IC FPGA 34 I/O 44PLCC

Microchip Technology

3,355 97.15
A40MX02-3PLG44

数据手册

MX 44-LCC (J-Lead) Tray Active Not Verified - - - 34 3000 3V ~ 3.6V, 4.75V ~ 5.25V Surface Mount 0°C ~ 70°C (TA) - - 44-PLCC (16.59x16.59)