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制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
A40MX04-2PQG100

A40MX04-2PQG100

IC FPGA 69 I/O 100QFP

Microchip Technology

4,812 97.15
A40MX04-2PQG100

数据手册

MX 100-BQFP Tray Active Not Verified - - - 69 6000 3V ~ 3.6V, 4.75V ~ 5.25V Surface Mount 0°C ~ 70°C (TA) - - 100-PQFP (20x14)
A40MX02-2PQG100I

A40MX02-2PQG100I

IC FPGA 57 I/O 100QFP

Microchip Technology

4,994 97.15
A40MX02-2PQG100I

数据手册

MX 100-BQFP Tray Active Not Verified - - - 57 3000 3V ~ 3.6V, 4.5V ~ 5.5V Surface Mount -40°C ~ 85°C (TA) - - 100-PQFP (20x14)
A40MX04-1PLG68I

A40MX04-1PLG68I

IC FPGA 57 I/O 68PLCC

Microchip Technology

1,537 97.15
A40MX04-1PLG68I

数据手册

MX 68-LCC (J-Lead) Tray Active Not Verified - - - 57 6000 3V ~ 3.6V, 4.5V ~ 5.5V Surface Mount -40°C ~ 85°C (TA) - - 68-PLCC (24.23x24.23)
M1A3P1000L-1FG144

M1A3P1000L-1FG144

IC FPGA 97 I/O 144FBGA

Microchip Technology

4,363 96.95
M1A3P1000L-1FG144

数据手册

ProASIC3L 144-LBGA Tray Active Not Verified - - 147456 97 1000000 1.14V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 144-FPBGA (13x13)
A3P1000L-1FG144

A3P1000L-1FG144

IC FPGA 97 I/O 144FBGA

Microchip Technology

2,138 96.95
A3P1000L-1FG144

数据手册

ProASIC3L 144-LBGA Tray Active Not Verified - - 147456 97 1000000 1.14V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 144-FPBGA (13x13)
M1A3P1000L-1FGG144

M1A3P1000L-1FGG144

IC FPGA 97 I/O 144FBGA

Microchip Technology

4,602 96.95
M1A3P1000L-1FGG144

数据手册

ProASIC3L 144-LBGA Tray Active Not Verified - - 147456 97 1000000 1.14V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 144-FPBGA (13x13)
A3P1000L-1FGG144

A3P1000L-1FGG144

IC FPGA 97 I/O 144FBGA

Microchip Technology

3,596 96.95
A3P1000L-1FGG144

数据手册

ProASIC3L 144-LBGA Tray Active Not Verified - - 147456 97 1000000 1.14V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 144-FPBGA (13x13)
M2GL050-1VF400I

M2GL050-1VF400I

IC FPGA 207 I/O 400VFBGA

Microchip Technology

1,883 103.41
M2GL050-1VF400I

数据手册

IGLOO2 400-LFBGA Tray Active Not Verified - 56340 1869824 207 - 1.14V ~ 2.625V Surface Mount -40°C ~ 100°C (TJ) - - 400-VFBGA (17x17)
M2GL050-1VFG400I

M2GL050-1VFG400I

IC FPGA 207 I/O 400VFBGA

Microchip Technology

1,318 103.41
M2GL050-1VFG400I

数据手册

IGLOO2 400-LFBGA Tray Active Not Verified - 56340 1869824 207 - 1.14V ~ 2.625V Surface Mount -40°C ~ 100°C (TJ) - - 400-VFBGA (17x17)
AFS250-1FG256

AFS250-1FG256

IC FPGA 114 I/O 256FBGA

Microchip Technology

3,280 99.46
AFS250-1FG256

数据手册

Fusion® 256-LBGA Tray Active Not Verified - - 36864 114 250000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 256-FPBGA (17x17)