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制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
M1AFS250-1FGG256

M1AFS250-1FGG256

IC FPGA 114 I/O 256FBGA

Microchip Technology

4,482 99.46
M1AFS250-1FGG256

数据手册

Fusion® 256-LBGA Tray Active Not Verified - - 36864 114 250000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 256-FPBGA (17x17)
AFS250-1FGG256

AFS250-1FGG256

IC FPGA 114 I/O 256FBGA

Microchip Technology

3,572 99.46
AFS250-1FGG256

数据手册

Fusion® 256-LBGA Tray Active Not Verified - - 36864 114 250000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 256-FPBGA (17x17)
M1AFS250-1FG256

M1AFS250-1FG256

IC FPGA 114 I/O 256FBGA

Microchip Technology

3,412 99.46
M1AFS250-1FG256

数据手册

Fusion® 256-LBGA Tray Active Not Verified - - 36864 114 250000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 256-FPBGA (17x17)
A40MX04-1PLG84I

A40MX04-1PLG84I

IC FPGA 69 I/O 84PLCC

Microchip Technology

1,345 98.16
A40MX04-1PLG84I

数据手册

MX 84-LCC (J-Lead) Tray Last Time Buy Not Verified - - - 69 6000 3V ~ 3.6V, 4.5V ~ 5.5V Surface Mount -40°C ~ 85°C (TA) - - 84-PLCC (29.31x29.31)
A40MX04-VQG80I

A40MX04-VQG80I

IC FPGA 69 I/O 80VQFP

Microchip Technology

3,490 98.16
A40MX04-VQG80I

数据手册

MX 80-TQFP Tray Active Not Verified - - - 69 6000 3V ~ 3.6V, 4.5V ~ 5.5V Surface Mount -40°C ~ 85°C (TA) - - 80-VQFP (14x14)
A40MX04-1VQG80

A40MX04-1VQG80

IC FPGA 69 I/O 80VQFP

Microchip Technology

4,417 98.16
A40MX04-1VQG80

数据手册

MX 80-TQFP Tray Active Not Verified - - - 69 6000 3V ~ 3.6V, 4.75V ~ 5.25V Surface Mount 0°C ~ 70°C (TA) - - 80-VQFP (14x14)
M2GL050T-1FG484

M2GL050T-1FG484

IC FPGA 267 I/O 484FBGA

Microchip Technology

2,820 104.18
M2GL050T-1FG484

数据手册

IGLOO2 484-BGA Tray Active Not Verified - 56340 1869824 267 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)
M2GL050T-1FGG484

M2GL050T-1FGG484

IC FPGA 267 I/O 484FBGA

Microchip Technology

1,256 104.18
M2GL050T-1FGG484

数据手册

IGLOO2 484-BGA Tray Active Not Verified - 56340 1869824 267 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)
M2GL050T-FGG484I

M2GL050T-FGG484I

IC FPGA 267 I/O 484FBGA

Microchip Technology

4,824 104.18
M2GL050T-FGG484I

数据手册

IGLOO2 484-BGA Tray Active Not Verified - 56340 1869824 267 - 1.14V ~ 2.625V Surface Mount -40°C ~ 100°C (TJ) - - 484-FPBGA (23x23)
M2GL050T-FG484I

M2GL050T-FG484I

IC FPGA 267 I/O 484FBGA

Microchip Technology

3,350 104.18
M2GL050T-FG484I

数据手册

IGLOO2 484-BGA Tray Active Not Verified - 56340 1869824 267 - 1.14V ~ 2.625V Surface Mount -40°C ~ 100°C (TJ) - - 484-FPBGA (23x23)