产品中心

制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
A42MX16-FPQG100

A42MX16-FPQG100

IC FPGA 83 I/O 100QFP

Microchip Technology

3,475 101.45
A42MX16-FPQG100

数据手册

MX 100-BQFP Tray Active Not Verified - - - 83 24000 3V ~ 3.6V, 4.75V ~ 5.25V Surface Mount 0°C ~ 70°C (TA) - - 100-PQFP (20x14)
A40MX04-2PLG44I

A40MX04-2PLG44I

IC FPGA 34 I/O 44PLCC

Microchip Technology

4,841 101.45
A40MX04-2PLG44I

数据手册

MX 44-LCC (J-Lead) Tray Active Not Verified - - - 34 6000 3V ~ 3.6V, 4.5V ~ 5.5V Surface Mount -40°C ~ 85°C (TA) - - 44-PLCC (16.59x16.59)
A3P1000-1FGG484I

A3P1000-1FGG484I

IC FPGA 300 I/O 484FBGA

Microchip Technology

3,040 102.02
A3P1000-1FGG484I

数据手册

ProASIC3 484-BGA Tray Active Not Verified - - 147456 300 1000000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 484-FPBGA (23x23)
M1A3P1000-1FG484I

M1A3P1000-1FG484I

IC FPGA 300 I/O 484FBGA

Microchip Technology

3,102 102.02

-

ProASIC3 484-BGA Tray Active Not Verified - - 147456 300 1000000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 484-FPBGA (23x23)
M1A3P1000-1FGG484I

M1A3P1000-1FGG484I

IC FPGA 300 I/O 484FBGA

Microchip Technology

1,391 102.02

-

ProASIC3 484-BGA Tray Active Not Verified - - 147456 300 1000000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 484-FPBGA (23x23)
A3P1000-1FG484I

A3P1000-1FG484I

IC FPGA 300 I/O 484FBGA

Microchip Technology

4,650 102.02
A3P1000-1FG484I

数据手册

ProASIC3 484-BGA Tray Active Not Verified - - 147456 300 1000000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 484-FPBGA (23x23)
M2GL050-1FG484I

M2GL050-1FG484I

IC FPGA 267 I/O 484FBGA

Microchip Technology

2,075 108.35
M2GL050-1FG484I

数据手册

IGLOO2 484-BGA Tray Active Not Verified - 56340 1869824 267 - 1.14V ~ 2.625V Surface Mount -40°C ~ 100°C (TJ) - - 484-FPBGA (23x23)
M2GL050-1FGG484I

M2GL050-1FGG484I

IC FPGA 267 I/O 484FBGA

Microchip Technology

3,426 108.35
M2GL050-1FGG484I

数据手册

IGLOO2 484-BGA Tray Active Not Verified - 56340 1869824 267 - 1.14V ~ 2.625V Surface Mount -40°C ~ 100°C (TJ) - - 484-FPBGA (23x23)
M1AGL1000V5-FGG144

M1AGL1000V5-FGG144

IC FPGA 97 I/O 144FBGA

Microchip Technology

2,254 103.37
M1AGL1000V5-FGG144

数据手册

IGLOO 144-LBGA Tray Active Not Verified - 24576 147456 97 1000000 1.425V ~ 1.575V Surface Mount 0°C ~ 70°C (TA) - - 144-FPBGA (13x13)
M1AGL1000V5-FG144

M1AGL1000V5-FG144

IC FPGA 97 I/O 144FBGA

Microchip Technology

4,549 103.37
M1AGL1000V5-FG144

数据手册

IGLOO 144-LBGA Tray Active Not Verified - 24576 147456 97 1000000 1.425V ~ 1.575V Surface Mount 0°C ~ 70°C (TA) - - 144-FPBGA (13x13)