产品中心

制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
M2GL090T-FG484I

M2GL090T-FG484I

IC FPGA 267 I/O 484FBGA

Microchip Technology

4,964 185.18
M2GL090T-FG484I

数据手册

IGLOO2 484-BGA Tray Active Not Verified - 86184 2648064 267 - 1.14V ~ 2.625V Surface Mount -40°C ~ 100°C (TJ) - - 484-FPBGA (23x23)
M2GL090T-FGG484I

M2GL090T-FGG484I

IC FPGA 267 I/O 484FBGA

Microchip Technology

4,492 185.18
M2GL090T-FGG484I

数据手册

IGLOO2 484-BGA Tray Active Not Verified - 86184 2648064 267 - 1.14V ~ 2.625V Surface Mount -40°C ~ 100°C (TJ) - - 484-FPBGA (23x23)
M2GL090TS-FG484

M2GL090TS-FG484

IC FPGA 267 I/O 484FBGA

Microchip Technology

2,568 185.18
M2GL090TS-FG484

数据手册

IGLOO2 484-BGA Tray Active Not Verified - 86184 2648064 267 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)
M2GL090TS-FGG484

M2GL090TS-FGG484

IC FPGA 267 I/O 484FBGA

Microchip Technology

2,365 185.18
M2GL090TS-FGG484

数据手册

IGLOO2 484-BGA Tray Active Not Verified - 86184 2648064 267 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)
A42MX09-2VQG100I

A42MX09-2VQG100I

IC FPGA 83 I/O 100VQFP

Microchip Technology

3,519 175.75
A42MX09-2VQG100I

数据手册

MX 100-TQFP Tray Active Not Verified - - - 83 14000 3V ~ 3.6V, 4.5V ~ 5.5V Surface Mount -40°C ~ 85°C (TA) - - 100-VQFP (14x14)
A42MX16-PQG160

A42MX16-PQG160

IC FPGA 125 I/O 160QFP

Microchip Technology

2,223 175.40
A42MX16-PQG160

数据手册

MX 160-BQFP Tray Active Not Verified - - - 125 24000 3V ~ 3.6V, 4.75V ~ 5.25V Surface Mount 0°C ~ 70°C (TA) - - 160-PQFP (28x28)
A42MX09-1PQG160

A42MX09-1PQG160

IC FPGA 101 I/O 160QFP

Microchip Technology

4,703 175.74
A42MX09-1PQG160

数据手册

MX 160-BQFP Tray Active Not Verified - - - 101 14000 3V ~ 3.6V, 4.75V ~ 5.25V Surface Mount 0°C ~ 70°C (TA) - - 160-PQFP (28x28)
M2GL090-1FG676

M2GL090-1FG676

IC FPGA 425 I/O 676FBGA

Microchip Technology

2,362 187.90
M2GL090-1FG676

数据手册

IGLOO2 676-BGA Tray Active Not Verified - 86316 2648064 425 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 676-FBGA (27x27)
M2GL090-1FGG676

M2GL090-1FGG676

IC FPGA 425 I/O 676FBGA

Microchip Technology

4,157 187.90
M2GL090-1FGG676

数据手册

IGLOO2 676-BGA Tray Active Not Verified - 86316 2648064 425 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 676-FBGA (27x27)
M2GL090-FG676I

M2GL090-FG676I

IC FPGA 425 I/O 676FBGA

Microchip Technology

4,701 187.90
M2GL090-FG676I

数据手册

IGLOO2 676-BGA Tray Active Not Verified - 86184 2648064 425 - 1.14V ~ 2.625V Surface Mount -40°C ~ 100°C (TJ) - - 676-FBGA (27x27)