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制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
M2GL090-FGG676I

M2GL090-FGG676I

IC FPGA 425 I/O 676FBGA

Microchip Technology

2,031 187.90
M2GL090-FGG676I

数据手册

IGLOO2 676-BGA Tray Active Not Verified - 86184 2648064 425 - 1.14V ~ 2.625V Surface Mount -40°C ~ 100°C (TJ) - - 676-FBGA (27x27)
A42MX09-2PLG84I

A42MX09-2PLG84I

IC FPGA 72 I/O 84PLCC

Microchip Technology

4,254 179.06
A42MX09-2PLG84I

数据手册

MX 84-LCC (J-Lead) Tray Last Time Buy Not Verified - - - 72 14000 3V ~ 3.6V, 4.5V ~ 5.5V Surface Mount -40°C ~ 85°C (TA) - - 84-PLCC (29.31x29.31)
A3P250-1VQ100M

A3P250-1VQ100M

IC FPGA 68 I/O 100VQFP

Microchip Technology

4,957 179.22
A3P250-1VQ100M

数据手册

ProASIC3 100-TQFP Tray Active Not Verified - - 36864 68 250000 1.425V ~ 1.575V Surface Mount -55°C ~ 125°C (TJ) - - 100-VQFP (14x14)
A3P250-1VQG100M

A3P250-1VQG100M

IC FPGA 68 I/O 100VQFP

Microchip Technology

3,617 179.22
A3P250-1VQG100M

数据手册

ProASIC3 100-TQFP Tray Active Not Verified - - 36864 68 250000 1.425V ~ 1.575V Surface Mount -55°C ~ 125°C (TJ) - - 100-VQFP (14x14)
M1A3PE1500-FGG484

M1A3PE1500-FGG484

IC FPGA 280 I/O 484FBGA

Microchip Technology

3,126 180.83
M1A3PE1500-FGG484

数据手册

ProASIC3E 484-BGA Tray Active Not Verified - - 276480 280 1500000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)
A3PE1500-FGG484

A3PE1500-FGG484

IC FPGA 280 I/O 484FBGA

Microchip Technology

1,042 180.83
A3PE1500-FGG484

数据手册

ProASIC3E 484-BGA Tray Active Not Verified - - 276480 280 1500000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)
A3PE1500-FG484

A3PE1500-FG484

IC FPGA 280 I/O 484FBGA

Microchip Technology

2,834 180.83
A3PE1500-FG484

数据手册

ProASIC3E 484-BGA Tray Active Not Verified - - 276480 280 1500000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)
M1A3PE1500-FG484

M1A3PE1500-FG484

IC FPGA 280 I/O 484FBGA

Microchip Technology

2,046 180.83
M1A3PE1500-FG484

数据手册

ProASIC3E 484-BGA Tray Active Not Verified - - 276480 280 1500000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)
A42MX16-1PLG84

A42MX16-1PLG84

IC FPGA 72 I/O 84PLCC

Microchip Technology

4,727 181.70
A42MX16-1PLG84

数据手册

MX 84-LCC (J-Lead) Tray Last Time Buy Not Verified - - - 72 24000 3V ~ 3.6V, 4.75V ~ 5.25V Surface Mount 0°C ~ 70°C (TA) - - 84-PLCC (29.31x29.31)
M2GL090-1FG484I

M2GL090-1FG484I

IC FPGA 267 I/O 484FBGA

Microchip Technology

1,490 192.59
M2GL090-1FG484I

数据手册

IGLOO2 484-BGA Tray Active Not Verified - 86316 2648064 267 - 1.14V ~ 2.625V Surface Mount -40°C ~ 100°C - - 484-FPBGA (23x23)