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制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
A3P1000L-1FGG144I

A3P1000L-1FGG144I

IC FPGA 97 I/O 144FBGA

Microchip Technology

1,503 188.26
A3P1000L-1FGG144I

数据手册

ProASIC3L 144-LBGA Tray Active Not Verified - - 147456 97 1000000 1.14V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 144-FPBGA (13x13)
A42MX24-FPQG160

A42MX24-FPQG160

IC FPGA 125 I/O 160QFP

Microchip Technology

1,190 188.43
A42MX24-FPQG160

数据手册

MX 160-BQFP Tray Active Not Verified - - - 125 36000 3V ~ 3.6V, 4.75V ~ 5.25V Surface Mount 0°C ~ 70°C (TA) - - 160-PQFP (28x28)
A42MX16-1PQG100

A42MX16-1PQG100

IC FPGA 83 I/O 100QFP

Microchip Technology

4,957 192.28
A42MX16-1PQG100

数据手册

MX 100-BQFP Tray Active Not Verified - - - 83 24000 3V ~ 3.6V, 4.75V ~ 5.25V Surface Mount 0°C ~ 70°C (TA) - - 100-PQFP (20x14)
A42MX09-3PLG84

A42MX09-3PLG84

IC FPGA 72 I/O 84PLCC

Microchip Technology

1,955 192.44
A42MX09-3PLG84

数据手册

MX 84-LCC (J-Lead) Tray Last Time Buy Not Verified - - - 72 14000 3V ~ 3.6V, 4.75V ~ 5.25V Surface Mount 0°C ~ 70°C (TA) - - 84-PLCC (29.31x29.31)
M2GL090T-1FG676

M2GL090T-1FG676

IC FPGA 425 I/O 676FBGA

Microchip Technology

3,228 204.26
M2GL090T-1FG676

数据手册

IGLOO2 676-BGA Tray Active Not Verified - 86316 2648064 425 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 676-FBGA (27x27)
M2GL090T-1FGG676

M2GL090T-1FGG676

IC FPGA 425 I/O 676FBGA

Microchip Technology

1,275 204.26
M2GL090T-1FGG676

数据手册

IGLOO2 676-BGA Tray Active Not Verified - 86316 2648064 425 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 676-FBGA (27x27)
M2GL090T-FG676I

M2GL090T-FG676I

IC FPGA 425 I/O 676FBGA

Microchip Technology

3,692 204.26
M2GL090T-FG676I

数据手册

IGLOO2 676-BGA Tray Active Not Verified - 86184 2648064 425 - 1.14V ~ 2.625V Surface Mount -40°C ~ 100°C (TJ) - - 676-FBGA (27x27)
M2GL090T-FGG676I

M2GL090T-FGG676I

IC FPGA 425 I/O 676FBGA

Microchip Technology

1,634 204.26
M2GL090T-FGG676I

数据手册

IGLOO2 676-BGA Tray Active Not Verified - 86184 2648064 425 - 1.14V ~ 2.625V Surface Mount -40°C ~ 100°C (TJ) - - 676-FBGA (27x27)
M2GL090TS-FG676

M2GL090TS-FG676

IC FPGA 425 I/O 676FBGA

Microchip Technology

4,095 204.26
M2GL090TS-FG676

数据手册

IGLOO2 676-BGA Tray Active Not Verified - 86184 2648064 425 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 676-FBGA (27x27)
M2GL090TS-FGG676

M2GL090TS-FGG676

IC FPGA 425 I/O 676FBGA

Microchip Technology

2,575 204.26
M2GL090TS-FGG676

数据手册

IGLOO2 676-BGA Tray Active Not Verified - 86184 2648064 425 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 676-FBGA (27x27)