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制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
A3PE1500-FG676

A3PE1500-FG676

IC FPGA 444 I/O 676FBGA

Microchip Technology

2,317 193.43
A3PE1500-FG676

数据手册

ProASIC3E 676-BGA Tray Active Not Verified - - 276480 444 1500000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 676-FBGA (27x27)
A3PE1500-FGG676

A3PE1500-FGG676

IC FPGA 444 I/O 676FBGA

Microchip Technology

2,939 193.43
A3PE1500-FGG676

数据手册

ProASIC3E 676-BGA Tray Active Not Verified - - 276480 444 1500000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 676-FBGA (27x27)
M1A3PE1500-FG676

M1A3PE1500-FG676

IC FPGA 444 I/O 676FBGA

Microchip Technology

2,744 193.43
M1A3PE1500-FG676

数据手册

ProASIC3E 676-BGA Tray Active Not Verified - - 276480 444 1500000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 676-FBGA (27x27)
M1A3PE1500-FGG676

M1A3PE1500-FGG676

IC FPGA 444 I/O 676FBGA

Microchip Technology

3,905 193.43
M1A3PE1500-FGG676

数据手册

ProASIC3E 676-BGA Tray Active Not Verified - - 276480 444 1500000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 676-FBGA (27x27)
M1A3PE1500-PQG208I

M1A3PE1500-PQG208I

IC FPGA 147 I/O 208QFP

Microchip Technology

2,626 194.25
M1A3PE1500-PQG208I

数据手册

ProASIC3E 208-BFQFP Tray Active Not Verified - - 276480 147 1500000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 208-PQFP (28x28)
A42MX16-1VQG100

A42MX16-1VQG100

IC FPGA 83 I/O 100VQFP

Microchip Technology

4,743 195.95
A42MX16-1VQG100

数据手册

MX 100-TQFP Tray Active Not Verified - - - 83 24000 3V ~ 3.6V, 4.75V ~ 5.25V Surface Mount 0°C ~ 70°C (TA) - - 100-VQFP (14x14)
A42MX09-3PQG100

A42MX09-3PQG100

IC FPGA 83 I/O 100QFP

Microchip Technology

4,144 195.95
A42MX09-3PQG100

数据手册

MX 100-BQFP Tray Active Not Verified - - - 83 14000 3V ~ 3.6V, 4.75V ~ 5.25V Surface Mount 0°C ~ 70°C (TA) - - 100-PQFP (20x14)
M2GL090T-1FG484I

M2GL090T-1FG484I

IC FPGA 267 I/O 484FBGA

Microchip Technology

1,520 207.40
M2GL090T-1FG484I

数据手册

IGLOO2 484-BGA Tray Active Not Verified - 86316 2648064 267 - 1.14V ~ 2.625V Surface Mount -40°C ~ 100°C (TJ) - - 484-FPBGA (23x23)
M2GL090T-1FGG484I

M2GL090T-1FGG484I

IC FPGA 267 I/O 484FBGA

Microchip Technology

3,836 207.40
M2GL090T-1FGG484I

数据手册

IGLOO2 484-BGA Tray Active Not Verified - 86316 2648064 267 - 1.14V ~ 2.625V Surface Mount -40°C ~ 100°C (TJ) - - 484-FPBGA (23x23)
M2GL090TS-1FG484

M2GL090TS-1FG484

IC FPGA 267 I/O 484FBGA

Microchip Technology

1,619 207.40
M2GL090TS-1FG484

数据手册

IGLOO2 484-BGA Tray Active Not Verified - 86184 2648064 267 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)