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制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
M1A3PE3000-FG484

M1A3PE3000-FG484

IC FPGA 341 I/O 484FBGA

Microchip Technology

2,529 376.99
M1A3PE3000-FG484

数据手册

ProASIC3E 484-BGA Tray Active Not Verified - - 516096 341 3000000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)
A54SX16P-2TQG176I

A54SX16P-2TQG176I

IC FPGA 147 I/O 176TQFP

Microchip Technology

4,761 379.61
A54SX16P-2TQG176I

数据手册

SX 176-LQFP Tray Obsolete Not Verified 1452 - - 147 24000 3V ~ 3.6V, 4.75V ~ 5.25V Surface Mount -40°C ~ 85°C (TA) - - 176-TQFP (24x24)
A42MX24-2PQG160

A42MX24-2PQG160

IC FPGA 125 I/O 160QFP

Microchip Technology

3,109 378.90
A42MX24-2PQG160

数据手册

MX 160-BQFP Tray Active Not Verified - - - 125 36000 3V ~ 3.6V, 4.75V ~ 5.25V Surface Mount 0°C ~ 70°C (TA) - - 160-PQFP (28x28)
AFS1500-FGG484

AFS1500-FGG484

IC FPGA 223 I/O 484FBGA

Microchip Technology

2,110 388.00
AFS1500-FGG484

数据手册

Fusion® 484-BGA Tray Active Not Verified - - 276480 223 1500000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)
M1AFS1500-FG484

M1AFS1500-FG484

IC FPGA 223 I/O 484FBGA

Microchip Technology

3,496 388.00
M1AFS1500-FG484

数据手册

Fusion® 484-BGA Tray Active Not Verified - - 276480 223 1500000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)
AFS1500-FG484

AFS1500-FG484

IC FPGA 223 I/O 484FBGA

Microchip Technology

2,149 388.00
AFS1500-FG484

数据手册

Fusion® 484-BGA Tray Active Not Verified - - 276480 223 1500000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)
M1AFS1500-FGG484

M1AFS1500-FGG484

IC FPGA 223 I/O 484FBGA

Microchip Technology

3,260 388.00
M1AFS1500-FGG484

数据手册

Fusion® 484-BGA Tray Active Not Verified - - 276480 223 1500000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)
A42MX24-3PLG84

A42MX24-3PLG84

IC FPGA 72 I/O 84PLCC

Microchip Technology

1,697 383.25
A42MX24-3PLG84

数据手册

MX 84-LCC (J-Lead) Tray Last Time Buy Not Verified - - - 72 36000 3V ~ 3.6V, 4.75V ~ 5.25V Surface Mount 0°C ~ 70°C (TA) - - 84-PLCC (29.31x29.31)
M7AFS600-2FGG484I

M7AFS600-2FGG484I

IC FPGA 172 I/O 484FBGA

Microchip Technology

2,577 391.73

-

Fusion® 484-BGA Tray Active Not Verified - - 110592 172 600000 1.425V ~ 1.575V Surface Mount -40°C ~ 85°C (TA) - - 484-FPBGA (23x23)
M7AFS600-2FG484I

M7AFS600-2FG484I

IC FPGA 172 I/O 484FBGA

Microchip Technology

4,255 391.73

-

Fusion® 484-BGA Tray Active Not Verified - - 110592 172 600000 1.425V ~ 1.575V Surface Mount -40°C ~ 85°C (TA) - - 484-FPBGA (23x23)