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制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
A42MX24-1PQG160I

A42MX24-1PQG160I

IC FPGA 125 I/O 160QFP

Microchip Technology

2,219 385.90
A42MX24-1PQG160I

数据手册

MX 160-BQFP Tray Active Not Verified - - - 125 36000 3V ~ 3.6V, 4.5V ~ 5.5V Surface Mount -40°C ~ 85°C (TA) - - 160-PQFP (28x28)
APA450-BG456

APA450-BG456

IC FPGA 344 I/O 456BGA

Microchip Technology

2,676 394.55
APA450-BG456

数据手册

ProASICPLUS 456-BBGA Tray Active Not Verified - - 110592 344 450000 2.3V ~ 2.7V Surface Mount 0°C ~ 70°C (TA) - - 456-PBGA (35x35)
APA450-BGG456

APA450-BGG456

IC FPGA 344 I/O 456BGA

Microchip Technology

2,883 394.55
APA450-BGG456

数据手册

ProASICPLUS 456-BBGA Tray Active Not Verified - - 110592 344 450000 2.3V ~ 2.7V Surface Mount 0°C ~ 70°C (TA) - - 456-PBGA (35x35)
A54SX16P-2PQG208I

A54SX16P-2PQG208I

IC FPGA 175 I/O 208QFP

Microchip Technology

4,673 389.64
A54SX16P-2PQG208I

数据手册

SX 208-BFQFP Tray Active Not Verified 1452 - - 175 24000 3V ~ 3.6V, 4.75V ~ 5.25V Surface Mount -40°C ~ 85°C (TA) - - 208-PQFP (28x28)
MPF200T-1FCSG536E

MPF200T-1FCSG536E

IC FPGA 300 I/O 536CSPBGA

Microchip Technology

1,026 445.02
MPF200T-1FCSG536E

数据手册

PolarFire™ 536-LFBGA, CSPBGA Tray Active Not Verified - 192000 13619200 300 - 0.97V ~ 1.08V Surface Mount 0°C ~ 100°C (TJ) - - 536-CSPBGA (16x16)
MPF200TL-FCSG536E

MPF200TL-FCSG536E

IC FPGA 300 I/O 536CSPBGA

Microchip Technology

2,614 445.02
MPF200TL-FCSG536E

数据手册

PolarFire™ 536-LFBGA, CSPBGA Tray Active Not Verified - 192000 13619200 300 - 0.97V ~ 1.08V Surface Mount 0°C ~ 100°C (TJ) - - 536-CSPBGA (16x16)
M2GL090T-1FGG484M

M2GL090T-1FGG484M

IC FPGA 267 I/O 484FBGA

Microchip Technology

4,125 414.81
M2GL090T-1FGG484M

数据手册

IGLOO2 484-BGA Tray Active Not Verified - 86184 2648064 267 - 1.14V ~ 2.625V Surface Mount -55°C ~ 125°C (TJ) - - 484-FPBGA (23x23)
MPF200T-1FCSG325I

MPF200T-1FCSG325I

IC FPGA 170 I/O 325FPGA

Microchip Technology

3,682 451.46
MPF200T-1FCSG325I

数据手册

PolarFire™ 325-LFBGA, FC Tray Active Not Verified - 192000 13619200 170 - 0.97V ~ 1.08V Surface Mount -40°C ~ 100°C (TJ) - - 325-FCBGA (11x14.5)
MPF200TL-FCSG325I

MPF200TL-FCSG325I

IC FPGA 170 I/O 325FPGA

Microchip Technology

3,916 451.46
MPF200TL-FCSG325I

数据手册

PolarFire™ 325-LFBGA, FC Tray Active Not Verified - 192000 13619200 170 - 0.97V ~ 1.08V Surface Mount -40°C ~ 100°C (TJ) - - 325-FCBGA (11x14.5)
M2GL150TS-1FCS536I

M2GL150TS-1FCS536I

IC FPGA 293 I/O 536CSPBGA

Microchip Technology

3,535 421.24
M2GL150TS-1FCS536I

数据手册

IGLOO2 536-LFBGA, CSPBGA Tray Active Not Verified - 146124 5120000 293 - 1.14V ~ 2.625V Surface Mount -40°C ~ 100°C (TJ) - - 536-CSPBGA (16x16)