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制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
A54SX72A-FG484A

A54SX72A-FG484A

IC FPGA 360 I/O 484FBGA

Microchip Technology

1,535 546.74
A54SX72A-FG484A

数据手册

SX-A 484-BGA Tray Active Not Verified 6036 - - 360 108000 2.25V ~ 5.25V Surface Mount -40°C ~ 125°C (TA) - - 484-FPBGA (27X27)
MPF300T-1FCVG484I

MPF300T-1FCVG484I

IC FPGA 284 I/O 484FCBGA

Microchip Technology

2,532 613.41
MPF300T-1FCVG484I

数据手册

PolarFire™ 484-BBGA, FCBGA Tray Active Not Verified - 300000 21094400 284 - 0.97V ~ 1.08V Surface Mount -40°C ~ 100°C (TJ) - - 484-FCBGA (19x19)
MPF300TL-FCVG484I

MPF300TL-FCVG484I

IC FPGA 284 I/O 484FCBGA

Microchip Technology

3,141 613.41
MPF300TL-FCVG484I

数据手册

PolarFire™ 484-BBGA, FCBGA Tray Active Not Verified - 300000 21094400 284 - 0.97V ~ 1.08V Surface Mount -40°C ~ 100°C (TJ) - - 484-FCBGA (19x19)
A3PE3000L-1PQG208

A3PE3000L-1PQG208

IC FPGA 147 I/O 208QFP

Microchip Technology

2,877 541.26
A3PE3000L-1PQG208

数据手册

ProASIC3L 208-BFQFP Tray Active Not Verified - - 516096 147 3000000 1.14V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 208-PQFP (28x28)
M1A3PE3000L-1PQG208

M1A3PE3000L-1PQG208

IC FPGA 147 I/O 208QFP

Microchip Technology

4,471 541.26
M1A3PE3000L-1PQG208

数据手册

ProASIC3L 208-BFQFP Tray Active Not Verified - - 516096 147 3000000 1.14V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 208-PQFP (28x28)
AFS600-FG484K

AFS600-FG484K

IC FPGA 172 I/O 484FBGA

Microchip Technology

4,723 551.74
AFS600-FG484K

数据手册

Fusion® 484-BGA Tray Active Not Verified - - 110592 172 600000 1.425V ~ 1.575V Surface Mount -55°C ~ 100°C (TJ) - - 484-FPBGA (23x23)
M1AFS600-FGG484K

M1AFS600-FGG484K

IC FPGA 172 I/O 484FBGA

Microchip Technology

1,202 551.74
M1AFS600-FGG484K

数据手册

Fusion® 484-BGA Tray Active Not Verified - - 110592 172 600000 1.425V ~ 1.575V Surface Mount -55°C ~ 100°C (TJ) - - 484-FPBGA (23x23)
M1AFS600-FG484K

M1AFS600-FG484K

IC FPGA 172 I/O 484FBGA

Microchip Technology

2,841 551.74
M1AFS600-FG484K

数据手册

Fusion® 484-BGA Tray Active Not Verified - - 110592 172 600000 1.425V ~ 1.575V Surface Mount -55°C ~ 100°C (TJ) - - 484-FPBGA (23x23)
A3PE3000L-1FG324

A3PE3000L-1FG324

IC FPGA 221 I/O 324FBGA

Microchip Technology

4,775 548.22
A3PE3000L-1FG324

数据手册

ProASIC3L 324-BGA Tray Active Not Verified - - 516096 221 3000000 1.14V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 324-FBGA (19x19)
A3PE3000L-1FGG324

A3PE3000L-1FGG324

IC FPGA 221 I/O 324FBGA

Microchip Technology

4,281 548.22
A3PE3000L-1FGG324

数据手册

ProASIC3L 324-BGA Tray Active Not Verified - - 516096 221 3000000 1.14V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 324-FBGA (19x19)