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制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
A42MX24-3PQG208I

A42MX24-3PQG208I

IC FPGA 176 I/O 208QFP

Microchip Technology

1,956 508.77
A42MX24-3PQG208I

数据手册

MX 208-BFQFP Tray Active Not Verified - - - 176 36000 3V ~ 3.6V, 4.5V ~ 5.5V Surface Mount -40°C ~ 85°C (TA) - - 208-PQFP (28x28)
A3PE3000-2FGG484I

A3PE3000-2FGG484I

IC FPGA 341 I/O 484FBGA

Microchip Technology

1,642 512.25
A3PE3000-2FGG484I

数据手册

ProASIC3E 484-BGA Tray Active Not Verified - - 516096 341 3000000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 484-FPBGA (23x23)
M1A3PE3000-2FGG484I

M1A3PE3000-2FGG484I

IC FPGA 341 I/O 484FBGA

Microchip Technology

3,174 512.25
M1A3PE3000-2FGG484I

数据手册

ProASIC3E 484-BGA Tray Active Not Verified - - 516096 341 3000000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 484-FPBGA (23x23)
A3PE3000-1FGG896I

A3PE3000-1FGG896I

IC FPGA 620 I/O 896FBGA

Microchip Technology

1,945 512.25
A3PE3000-1FGG896I

数据手册

ProASIC3E 896-BGA Tray Active Not Verified - - 516096 620 3000000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 896-FBGA (31x31)
M1A3PE3000-1FG896I

M1A3PE3000-1FG896I

IC FPGA 620 I/O 896FBGA

Microchip Technology

3,204 512.25
M1A3PE3000-1FG896I

数据手册

ProASIC3E 896-BGA Tray Active Not Verified - - 516096 620 3000000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 896-FBGA (31x31)
A3PE3000-1FG896I

A3PE3000-1FG896I

IC FPGA 620 I/O 896FBGA

Microchip Technology

1,183 512.25
A3PE3000-1FG896I

数据手册

ProASIC3E 896-BGA Tray Active Not Verified - - 516096 620 3000000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 896-FBGA (31x31)
M1A3PE3000-1FGG896I

M1A3PE3000-1FGG896I

IC FPGA 620 I/O 896FBGA

Microchip Technology

3,304 512.25
M1A3PE3000-1FGG896I

数据手册

ProASIC3E 896-BGA Tray Active Not Verified - - 516096 620 3000000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 896-FBGA (31x31)
AFS600-1FG256K

AFS600-1FG256K

IC FPGA 119 I/O 256FBGA

Microchip Technology

4,824 526.12
AFS600-1FG256K

数据手册

Fusion® 256-LBGA Tray Active Not Verified - - 110592 119 600000 1.425V ~ 1.575V Surface Mount -55°C ~ 100°C (TJ) - - 256-FPBGA (17x17)
AFS600-1FGG256K

AFS600-1FGG256K

IC FPGA 119 I/O 256FBGA

Microchip Technology

3,320 526.12
AFS600-1FGG256K

数据手册

Fusion® 256-LBGA Tray Active Not Verified - - 110592 119 600000 1.425V ~ 1.575V Surface Mount -55°C ~ 100°C (TJ) - - 256-FPBGA (17x17)
M1AFS600-1FG256K

M1AFS600-1FG256K

IC FPGA 119 I/O 256FBGA

Microchip Technology

1,130 526.12
M1AFS600-1FG256K

数据手册

Fusion® 256-LBGA Tray Active Not Verified - - 110592 119 600000 1.425V ~ 1.575V Surface Mount -55°C ~ 100°C (TJ) - - 256-FPBGA (17x17)