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制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
A42MX24-3PQG208

A42MX24-3PQG208

IC FPGA 176 I/O 208QFP

Microchip Technology

4,055 476.96
A42MX24-3PQG208

数据手册

MX 208-BFQFP Tray Active Not Verified - - - 176 36000 3V ~ 3.6V, 4.75V ~ 5.25V Surface Mount 0°C ~ 70°C (TA) - - 208-PQFP (28x28)
A54SX72A-2PQG208

A54SX72A-2PQG208

IC FPGA 171 I/O 208QFP

Microchip Technology

2,311 477.78
A54SX72A-2PQG208

数据手册

SX-A 208-BFQFP Tray Active Not Verified 6036 - - 171 108000 2.25V ~ 5.25V Surface Mount 0°C ~ 70°C (TA) - - 208-PQFP (28x28)
A54SX72A-1PQG208I

A54SX72A-1PQG208I

IC FPGA 171 I/O 208QFP

Microchip Technology

1,390 477.78
A54SX72A-1PQG208I

数据手册

SX-A 208-BFQFP Tray Active Not Verified 6036 - - 171 108000 2.25V ~ 5.25V Surface Mount -40°C ~ 85°C (TA) - - 208-PQFP (28x28)
M1A3PE3000L-PQG208

M1A3PE3000L-PQG208

IC FPGA 147 I/O 208QFP

Microchip Technology

2,332 480.78
M1A3PE3000L-PQG208

数据手册

ProASIC3L 208-BFQFP Tray Active Not Verified - - 516096 147 3000000 1.14V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 208-PQFP (28x28)
A40MX04-1PLG68M

A40MX04-1PLG68M

IC FPGA 57 I/O 68PLCC

Microchip Technology

4,188 481.64
A40MX04-1PLG68M

数据手册

MX 68-LCC (J-Lead) Tray Active Not Verified - - - 57 6000 3V ~ 3.6V, 4.5V ~ 5.5V Surface Mount -55°C ~ 125°C (TC) - - 68-PLCC (24.23x24.23)
M1A3PE3000-2FGG896

M1A3PE3000-2FGG896

IC FPGA 620 I/O 896FBGA

Microchip Technology

4,047 482.73
M1A3PE3000-2FGG896

数据手册

ProASIC3E 896-BGA Tray Active Not Verified - - 516096 620 3000000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 896-FBGA (31x31)
A3PE3000-2FG896

A3PE3000-2FG896

IC FPGA 620 I/O 896FBGA

Microchip Technology

4,624 482.73
A3PE3000-2FG896

数据手册

ProASIC3E 896-BGA Tray Active Not Verified - - 516096 620 3000000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 896-FBGA (31x31)
M1A3PE3000-2FG896

M1A3PE3000-2FG896

IC FPGA 620 I/O 896FBGA

Microchip Technology

1,978 482.73
M1A3PE3000-2FG896

数据手册

ProASIC3E 896-BGA Tray Active Not Verified - - 516096 620 3000000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 896-FBGA (31x31)
A3PE3000-2FGG896

A3PE3000-2FGG896

IC FPGA 620 I/O 896FBGA

Microchip Technology

3,018 482.73
A3PE3000-2FGG896

数据手册

ProASIC3E 896-BGA Tray Active Not Verified - - 516096 620 3000000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 896-FBGA (31x31)
A3PE3000L-FGG324

A3PE3000L-FGG324

IC FPGA 221 I/O 324FBGA

Microchip Technology

2,325 487.54
A3PE3000L-FGG324

数据手册

ProASIC3L 324-BGA Tray Active Not Verified - - 516096 221 3000000 1.14V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 324-FBGA (19x19)