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制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
APA450-FG256A

APA450-FG256A

IC FPGA 186 I/O 256FBGA

Microchip Technology

3,054 504.29
APA450-FG256A

数据手册

ProASICPLUS 256-LBGA Tray Active Not Verified - - 110592 186 450000 2.375V ~ 2.625V Surface Mount -40°C ~ 125°C (TJ) - - 256-FPBGA (17x17)
APA450-FGG256A

APA450-FGG256A

IC FPGA 186 I/O 256FBGA

Microchip Technology

1,256 504.29
APA450-FGG256A

数据手册

ProASICPLUS 256-LBGA Tray Active Not Verified - - 110592 186 450000 2.375V ~ 2.625V Surface Mount -40°C ~ 125°C (TJ) - - 256-FPBGA (17x17)
MPF300T-1FCG1152E

MPF300T-1FCG1152E

IC FPGA 512 I/O 1152FCBGA

Microchip Technology

2,403 558.78
MPF300T-1FCG1152E

数据手册

PolarFire™ 1152-BBGA, FCBGA Tray Active Not Verified - 300000 21094400 512 - 0.97V ~ 1.08V Surface Mount 0°C ~ 100°C (TJ) - - 1152-FCBGA (35x35)
MPF300TL-FCG1152E

MPF300TL-FCG1152E

IC FPGA 512 I/O 1152FCBGA

Microchip Technology

2,702 558.78
MPF300TL-FCG1152E

数据手册

PolarFire™ 1152-BBGA, FCBGA Tray Active Not Verified - 300000 21094400 512 - 0.97V ~ 1.08V Surface Mount 0°C ~ 100°C (TJ) - - 1152-FCBGA (35x35)
MPF300T-FCG1152I

MPF300T-FCG1152I

IC FPGA 512 I/O 1152FCBGA

Microchip Technology

1,301 558.78
MPF300T-FCG1152I

数据手册

PolarFire™ 1152-BBGA, FCBGA Tray Active Not Verified - 300000 21094400 512 - 0.97V ~ 1.08V Surface Mount -40°C ~ 100°C (TJ) - - 1152-FCBGA (35x35)
AX1000-FG676

AX1000-FG676

IC FPGA 418 I/O 676FBGA

Microchip Technology

3,631 493.14
AX1000-FG676

数据手册

Axcelerator 676-BGA Tray Active Not Verified 18144 - 165888 418 1000000 1.425V ~ 1.575V Surface Mount 0°C ~ 70°C (TA) - - 676-FBGA (27x27)
AX1000-FGG676

AX1000-FGG676

IC FPGA 418 I/O 676FBGA

Microchip Technology

4,739 493.14
AX1000-FGG676

数据手册

Axcelerator 676-BGA Tray Active Not Verified 18144 - 165888 418 1000000 1.425V ~ 1.575V Surface Mount 0°C ~ 70°C (TA) - - 676-FBGA (27x27)
MPF200TS-1FCSG325I

MPF200TS-1FCSG325I

IC FPGA 170 I/O 325FPGA

Microchip Technology

3,799 515.94
MPF200TS-1FCSG325I

数据手册

PolarFire™ 325-LFBGA, FC Tray Active Not Verified - 192000 13619200 170 - 0.97V ~ 1.08V Surface Mount -40°C ~ 100°C (TJ) - - 325-FCBGA (11x14.5)
M1A3PE3000L-FGG484

M1A3PE3000L-FGG484

IC FPGA 341 I/O 484FBGA

Microchip Technology

3,027 493.86
M1A3PE3000L-FGG484

数据手册

ProASIC3L 484-BGA Tray Active Not Verified - - 516096 341 3000000 1.14V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)
A3PE3000L-FGG484

A3PE3000L-FGG484

IC FPGA 341 I/O 484FBGA

Microchip Technology

4,351 493.86
A3PE3000L-FGG484

数据手册

ProASIC3L 484-BGA Tray Active Not Verified - - 516096 341 3000000 1.14V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)