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制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
A3PE3000-1FG324I

A3PE3000-1FG324I

IC FPGA 221 I/O 324FBGA

Microchip Technology

1,488 467.21
A3PE3000-1FG324I

数据手册

ProASIC3E 324-BGA Tray Active Not Verified - - 516096 221 3000000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 324-FBGA (19x19)
M1A3PE3000-1FGG324I

M1A3PE3000-1FGG324I

IC FPGA 221 I/O 324FBGA

Microchip Technology

1,889 467.21
M1A3PE3000-1FGG324I

数据手册

ProASIC3E 324-BGA Tray Active Not Verified - - 516096 221 3000000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 324-FBGA (19x19)
A3PE3000-1FGG324I

A3PE3000-1FGG324I

IC FPGA 221 I/O 324FBGA

Microchip Technology

3,979 467.21
A3PE3000-1FGG324I

数据手册

ProASIC3E 324-BGA Tray Active Not Verified - - 516096 221 3000000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 324-FBGA (19x19)
MPF300TL-FCG484I

MPF300TL-FCG484I

IC FPGA 244 I/O 484FCBGA

Microchip Technology

1,228 533.39
MPF300TL-FCG484I

数据手册

PolarFire™ 484-BBGA, FCBGA Tray Active Not Verified - 300000 21094400 244 - 0.97V ~ 1.08V Surface Mount -40°C ~ 100°C (TJ) - - 484-FCBGA (23x23)
M1AFS600-FGG256K

M1AFS600-FGG256K

IC FPGA 119 I/O 256FBGA

Microchip Technology

2,113 478.29
M1AFS600-FGG256K

数据手册

Fusion® 256-LBGA Tray Active Not Verified - - 110592 119 600000 1.425V ~ 1.575V Surface Mount -55°C ~ 100°C (TJ) - - 256-FPBGA (17x17)
AFS600-FGG256K

AFS600-FGG256K

IC FPGA 119 I/O 256FBGA

Microchip Technology

1,528 478.29
AFS600-FGG256K

数据手册

Fusion® 256-LBGA Tray Active Not Verified - - 110592 119 600000 1.425V ~ 1.575V Surface Mount -55°C ~ 100°C (TJ) - - 256-FPBGA (17x17)
M1A3PE3000-FG896I

M1A3PE3000-FG896I

IC FPGA 620 I/O 896FBGA

Microchip Technology

4,303 469.77
M1A3PE3000-FG896I

数据手册

ProASIC3E 896-BGA Tray Active Not Verified - - 516096 620 3000000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 896-FBGA (31x31)
A3PE3000-FG896I

A3PE3000-FG896I

IC FPGA 620 I/O 896FBGA

Microchip Technology

3,929 469.77
A3PE3000-FG896I

数据手册

ProASIC3E 896-BGA Tray Active Not Verified - - 516096 620 3000000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 896-FBGA (31x31)
M1A3PE3000-FGG896I

M1A3PE3000-FGG896I

IC FPGA 620 I/O 896FBGA

Microchip Technology

1,739 469.77
M1A3PE3000-FGG896I

数据手册

ProASIC3E 896-BGA Tray Active Not Verified - - 516096 620 3000000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 896-FBGA (31x31)
A3PE3000-FGG896I

A3PE3000-FGG896I

IC FPGA 620 I/O 896FBGA

Microchip Technology

3,908 469.77
A3PE3000-FGG896I

数据手册

ProASIC3E 896-BGA Tray Active Not Verified - - 516096 620 3000000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 896-FBGA (31x31)