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制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
M1A3PE3000-1FGG896

M1A3PE3000-1FGG896

IC FPGA 620 I/O 896FBGA

Microchip Technology

1,585 445.43
M1A3PE3000-1FGG896

数据手册

ProASIC3E 896-BGA Tray Active Not Verified - - 516096 620 3000000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 896-FBGA (31x31)
A3PE3000-1FG896

A3PE3000-1FG896

IC FPGA 620 I/O 896FBGA

Microchip Technology

1,757 445.43
A3PE3000-1FG896

数据手册

ProASIC3E 896-BGA Tray Active Not Verified - - 516096 620 3000000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 896-FBGA (31x31)
M1A3PE3000-1FG896

M1A3PE3000-1FG896

IC FPGA 620 I/O 896FBGA

Microchip Technology

3,029 445.43
M1A3PE3000-1FG896

数据手册

ProASIC3E 896-BGA Tray Active Not Verified - - 516096 620 3000000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 896-FBGA (31x31)
A3PE3000-1FGG896

A3PE3000-1FGG896

IC FPGA 620 I/O 896FBGA

Microchip Technology

4,874 445.43
A3PE3000-1FGG896

数据手册

ProASIC3E 896-BGA Tray Active Not Verified - - 516096 620 3000000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 896-FBGA (31x31)
M1A3PE3000-2FG484

M1A3PE3000-2FG484

IC FPGA 341 I/O 484FBGA

Microchip Technology

2,284 445.43
M1A3PE3000-2FG484

数据手册

ProASIC3E 484-BGA Tray Active Not Verified - - 516096 341 3000000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)
A3PE3000-2FG484

A3PE3000-2FG484

IC FPGA 341 I/O 484FBGA

Microchip Technology

3,797 445.43
A3PE3000-2FG484

数据手册

ProASIC3E 484-BGA Tray Active Not Verified - - 516096 341 3000000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)
M1A3PE3000-2FGG484

M1A3PE3000-2FGG484

IC FPGA 341 I/O 484FBGA

Microchip Technology

3,135 445.43
M1A3PE3000-2FGG484

数据手册

ProASIC3E 484-BGA Tray Active Not Verified - - 516096 341 3000000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)
A3PE3000-2FGG484

A3PE3000-2FGG484

IC FPGA 341 I/O 484FBGA

Microchip Technology

3,283 445.43
A3PE3000-2FGG484

数据手册

ProASIC3E 484-BGA Tray Active Not Verified - - 516096 341 3000000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)
MPF300T-1FCG784E

MPF300T-1FCG784E

IC FPGA 388 I/O 784FCBGA

Microchip Technology

2,011 507.98
MPF300T-1FCG784E

数据手册

PolarFire™ 784-BBGA, FCBGA Tray Active Not Verified - 300000 21094400 388 - 0.97V ~ 1.08V Surface Mount 0°C ~ 100°C (TJ) - - 784-FCBGA (29x29)
MPF300TL-FCG784E

MPF300TL-FCG784E

IC FPGA 388 I/O 784FCBGA

Microchip Technology

3,206 507.98
MPF300TL-FCG784E

数据手册

PolarFire™ 784-BBGA, FCBGA Tray Active Not Verified - 300000 21094400 388 - 0.97V ~ 1.08V Surface Mount 0°C ~ 100°C (TJ) - - 784-FCBGA (29x29)