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制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
M1A3PE3000-FGG484I

M1A3PE3000-FGG484I

IC FPGA 341 I/O 484FBGA

Microchip Technology

3,624 433.52
M1A3PE3000-FGG484I

数据手册

ProASIC3E 484-BGA Tray Active Not Verified - - 516096 341 3000000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 484-FPBGA (23x23)
M1A3PE3000-FG484I

M1A3PE3000-FG484I

IC FPGA 341 I/O 484FBGA

Microchip Technology

4,731 433.52
M1A3PE3000-FG484I

数据手册

ProASIC3E 484-BGA Tray Active Not Verified - - 516096 341 3000000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 484-FPBGA (23x23)
M1A3PE3000-2PQG208

M1A3PE3000-2PQG208

IC FPGA 147 I/O 208QFP

Microchip Technology

3,716 433.85
M1A3PE3000-2PQG208

数据手册

ProASIC3E 208-BFQFP Tray Active Not Verified - - 516096 147 3000000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 208-PQFP (28x28)
A42MX24-2TQG176I

A42MX24-2TQG176I

IC FPGA 150 I/O 176TQFP

Microchip Technology

3,040 437.34
A42MX24-2TQG176I

数据手册

MX 176-LQFP Tray Active Not Verified - - - 150 36000 3V ~ 3.6V, 4.5V ~ 5.5V Surface Mount -40°C ~ 85°C (TA) - - 176-TQFP (24x24)
A42MX24-2PQG208I

A42MX24-2PQG208I

IC FPGA 176 I/O 208QFP

Microchip Technology

4,793 438.50
A42MX24-2PQG208I

数据手册

MX 208-BFQFP Tray Active Not Verified - - - 176 36000 3V ~ 3.6V, 4.5V ~ 5.5V Surface Mount -40°C ~ 85°C (TA) - - 208-PQFP (28x28)
A42MX24-PQG208A

A42MX24-PQG208A

IC FPGA 176 I/O 208QFP

Microchip Technology

3,979 446.93
A42MX24-PQG208A

数据手册

MX 208-BFQFP Tray Active Not Verified - - - 176 36000 3V ~ 3.6V, 4.5V ~ 5.5V Surface Mount -40°C ~ 125°C (TA) - - 208-PQFP (28x28)
P1AFS1500-2FG256

P1AFS1500-2FG256

IC FPGA 119 I/O 256FBGA

Microchip Technology

4,517 447.02
P1AFS1500-2FG256

数据手册

Fusion® 256-LBGA Tray Active Not Verified - - 276480 119 1500000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 256-FPBGA (17x17)
P1AFS1500-2FGG256

P1AFS1500-2FGG256

IC FPGA 119 I/O 256FBGA

Microchip Technology

1,648 447.02
P1AFS1500-2FGG256

数据手册

Fusion® 256-LBGA Tray Active Not Verified - - 276480 119 1500000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 256-FPBGA (17x17)
M1AFS1500-2FGG256

M1AFS1500-2FGG256

IC FPGA 119 I/O 256FBGA

Microchip Technology

1,690 447.02
M1AFS1500-2FGG256

数据手册

Fusion® 256-LBGA Tray Active Not Verified - - 276480 119 1500000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 256-FPBGA (17x17)
AFS1500-2FGG256

AFS1500-2FGG256

IC FPGA 119 I/O 256FBGA

Microchip Technology

2,505 447.02
AFS1500-2FGG256

数据手册

Fusion® 256-LBGA Tray Active Not Verified - - 276480 119 1500000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 256-FPBGA (17x17)