产品中心

制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
M1AFS1500-1FG484

M1AFS1500-1FG484

IC FPGA 223 I/O 484FBGA

Microchip Technology

2,642 423.41
M1AFS1500-1FG484

数据手册

Fusion® 484-BGA Tray Active Not Verified - - 276480 223 1500000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)
AFS1500-1FG484

AFS1500-1FG484

IC FPGA 223 I/O 484FBGA

Microchip Technology

2,171 423.41
AFS1500-1FG484

数据手册

Fusion® 484-BGA Tray Active Not Verified - - 276480 223 1500000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)
M1A3PE3000-PQG208I

M1A3PE3000-PQG208I

IC FPGA 147 I/O 208QFP

Microchip Technology

4,027 422.39
M1A3PE3000-PQG208I

数据手册

ProASIC3E 208-BFQFP Tray Active Not Verified - - 516096 147 3000000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 208-PQFP (28x28)
A54SX32-BGG329

A54SX32-BGG329

IC FPGA 249 I/O 329BGA

Microchip Technology

3,451 424.94
A54SX32-BGG329

数据手册

SX 329-BBGA Tray Active Not Verified 2880 - - 249 48000 3V ~ 3.6V, 4.75V ~ 5.25V Surface Mount 0°C ~ 70°C (TA) - - 329-PBGA (31x31)
A54SX32-BG329

A54SX32-BG329

IC FPGA 249 I/O 329BGA

Microchip Technology

4,177 424.94
A54SX32-BG329

数据手册

SX 329-BBGA Tray Active Not Verified 2880 - - 249 48000 3V ~ 3.6V, 4.75V ~ 5.25V Surface Mount 0°C ~ 70°C (TA) - - 329-PBGA (31x31)
MPF200TLS-FCVG484I

MPF200TLS-FCVG484I

IC FPGA 284 I/O 484FBGA

Microchip Technology

4,637 448.66
MPF200TLS-FCVG484I

数据手册

PolarFire™ 484-BFBGA Tray Active Not Verified - 192000 13619200 284 - 0.97V ~ 1.08V Surface Mount -40°C ~ 100°C (TJ) - - 484-FPBGA (19x19)
MPF200TS-1FCVG484I

MPF200TS-1FCVG484I

IC FPGA 284 I/O 484FBGA

Microchip Technology

3,354 448.66
MPF200TS-1FCVG484I

数据手册

PolarFire™ 484-BFBGA Tray Active Not Verified - 192000 13619200 284 - 0.97V ~ 1.08V Surface Mount -40°C ~ 100°C (TJ) - - 484-FPBGA (19x19)
A54SX72A-FGG256I

A54SX72A-FGG256I

IC FPGA 203 I/O 256FBGA

Microchip Technology

2,242 430.26
A54SX72A-FGG256I

数据手册

SX-A 256-BGA Tray Active Not Verified 6036 - - 203 108000 2.25V ~ 5.25V Surface Mount -40°C ~ 85°C (TA) - - 256-FPBGA (17x17)
A54SX72A-1FG256

A54SX72A-1FG256

IC FPGA 203 I/O 256FBGA

Microchip Technology

4,629 430.26
A54SX72A-1FG256

数据手册

SX-A 256-BGA Tray Active Not Verified 6036 - - 203 108000 2.25V ~ 5.25V Surface Mount 0°C ~ 70°C (TA) - - 256-FPBGA (17x17)
A54SX72A-1FGG256

A54SX72A-1FGG256

IC FPGA 203 I/O 256FBGA

Microchip Technology

3,420 430.26
A54SX72A-1FGG256

数据手册

SX-A 256-BGA Tray Active Not Verified 6036 - - 203 108000 2.25V ~ 5.25V Surface Mount 0°C ~ 70°C (TA) - - 256-FPBGA (17x17)