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制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
MPF300TL-FCSG536I

MPF300TL-FCSG536I

IC FPGA 300 I/O 536CSPBGA

Microchip Technology

3,995 705.41
MPF300TL-FCSG536I

数据手册

PolarFire™ 536-LFBGA, CSPBGA Tray Active Not Verified - 300000 21094400 300 - 0.97V ~ 1.08V Surface Mount -40°C ~ 100°C (TJ) - - 536-CSPBGA (16x16)
A54SX16A-1TQG144M

A54SX16A-1TQG144M

IC FPGA 111 I/O 144TQFP

Microchip Technology

3,463 624.06
A54SX16A-1TQG144M

数据手册

SX-A 144-LQFP Tray Active Not Verified 1452 - - 111 24000 2.25V ~ 5.25V Surface Mount -55°C ~ 125°C (TC) - - 144-TQFP (20x20)
M2GL150T-1FCV484M

M2GL150T-1FCV484M

IC FPGA 248 I/O 484FBGA

Microchip Technology

4,850 661.68
M2GL150T-1FCV484M

数据手册

IGLOO2 484-BFBGA Tray Active Not Verified - 146124 5120000 248 - 1.14V ~ 2.625V Surface Mount -55°C ~ 125°C (TJ) - - 484-FBGA (19x19)
A42MX09-1PLG84M

A42MX09-1PLG84M

IC FPGA 72 I/O 84PLCC

Microchip Technology

3,979 625.25
A42MX09-1PLG84M

数据手册

MX 84-LCC (J-Lead) Tray Last Time Buy Not Verified - - - 72 14000 3V ~ 3.6V, 4.5V ~ 5.5V Surface Mount -55°C ~ 125°C (TC) - - 84-PLCC (29.31x29.31)
A54SX32-2BG329

A54SX32-2BG329

IC FPGA 249 I/O 329BGA

Microchip Technology

1,676 634.81
A54SX32-2BG329

数据手册

SX 329-BBGA Tray Active Not Verified 2880 - - 249 48000 3V ~ 3.6V, 4.75V ~ 5.25V Surface Mount 0°C ~ 70°C (TA) - - 329-PBGA (31x31)
A54SX32-1BGG329I

A54SX32-1BGG329I

IC FPGA 249 I/O 329BGA

Microchip Technology

1,152 634.81
A54SX32-1BGG329I

数据手册

SX 329-BBGA Tray Active Not Verified 2880 - - 249 48000 3V ~ 3.6V, 4.75V ~ 5.25V Surface Mount -40°C ~ 85°C (TA) - - 329-PBGA (31x31)
A54SX32-2BGG329

A54SX32-2BGG329

IC FPGA 249 I/O 329BGA

Microchip Technology

3,733 634.81
A54SX32-2BGG329

数据手册

SX 329-BBGA Tray Active Not Verified 2880 - - 249 48000 3V ~ 3.6V, 4.75V ~ 5.25V Surface Mount 0°C ~ 70°C (TA) - - 329-PBGA (31x31)
A54SX32-1BG329I

A54SX32-1BG329I

IC FPGA 249 I/O 329BGA

Microchip Technology

2,210 634.81
A54SX32-1BG329I

数据手册

SX 329-BBGA Tray Active Not Verified 2880 - - 249 48000 3V ~ 3.6V, 4.75V ~ 5.25V Surface Mount -40°C ~ 85°C (TA) - - 329-PBGA (31x31)
APA600-FG256

APA600-FG256

IC FPGA 186 I/O 256FBGA

Microchip Technology

3,616 644.86
APA600-FG256

数据手册

ProASICPLUS 256-LBGA Tray Active Not Verified - - 129024 186 600000 2.3V ~ 2.7V Surface Mount 0°C ~ 70°C (TA) - - 256-FPBGA (17x17)
APA600-FGG256

APA600-FGG256

IC FPGA 186 I/O 256FBGA

Microchip Technology

1,175 644.86
APA600-FGG256

数据手册

ProASICPLUS 256-LBGA Tray Active Not Verified - - 129024 186 600000 2.3V ~ 2.7V Surface Mount 0°C ~ 70°C (TA) - - 256-FPBGA (17x17)