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制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
MPF300TLS-FCG784I

MPF300TLS-FCG784I

IC FPGA 388 I/O 784FCBGA

Microchip Technology

2,485 677.32
MPF300TLS-FCG784I

数据手册

PolarFire™ 784-BBGA, FCBGA Tray Active Not Verified - 300000 21094400 388 - 0.97V ~ 1.08V Surface Mount -40°C ~ 100°C (TJ) - - 784-FCBGA (29x29)
MPF300TS-1FCG784I

MPF300TS-1FCG784I

IC FPGA 388 I/O 784FCBGA

Microchip Technology

3,177 677.32
MPF300TS-1FCG784I

数据手册

PolarFire™ 784-BBGA, FCBGA Tray Active Not Verified - 300000 21094400 388 - 0.97V ~ 1.08V Surface Mount -40°C ~ 100°C (TJ) - - 784-FCBGA (29x29)
U1AFS1500-FGG256I

U1AFS1500-FGG256I

IC FPGA 119 I/O 256FBGA

Microchip Technology

2,632 657.96
U1AFS1500-FGG256I

数据手册

Fusion® 256-LBGA Tray Active Not Verified - - 276480 119 1500000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 256-FPBGA (17x17)
U1AFS1500-FG256I

U1AFS1500-FG256I

IC FPGA 119 I/O 256FBGA

Microchip Technology

1,861 657.96
U1AFS1500-FG256I

数据手册

Fusion® 256-LBGA Tray Active Not Verified - - 276480 119 1500000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 256-FPBGA (17x17)
AX1000-1FGG484

AX1000-1FGG484

IC FPGA 317 I/O 484FBGA

Microchip Technology

3,151 652.46
AX1000-1FGG484

数据手册

Axcelerator 484-BGA Tray Active Not Verified 18144 - 165888 317 1000000 1.425V ~ 1.575V Surface Mount 0°C ~ 70°C (TA) - - 484-FPBGA (23x23)
AX1000-1FG484

AX1000-1FG484

IC FPGA 317 I/O 484FBGA

Microchip Technology

4,325 652.46
AX1000-1FG484

数据手册

Axcelerator 484-BGA Tray Active Not Verified 18144 - 165888 317 1000000 1.425V ~ 1.575V Surface Mount 0°C ~ 70°C (TA) - - 484-FPBGA (23x23)
AX1000-FGG484I

AX1000-FGG484I

IC FPGA 317 I/O 484FBGA

Microchip Technology

3,171 652.46
AX1000-FGG484I

数据手册

Axcelerator 484-BGA Tray Active Not Verified 18144 - 165888 317 1000000 1.425V ~ 1.575V Surface Mount -40°C ~ 85°C (TA) - - 484-FPBGA (23x23)
M1AFS1500-FG484I

M1AFS1500-FG484I

IC FPGA 223 I/O 484FBGA

Microchip Technology

4,236 672.82
M1AFS1500-FG484I

数据手册

Fusion® 484-BGA Tray Active Not Verified - - 276480 223 1500000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 484-FPBGA (23x23)
AFS1500-FGG484I

AFS1500-FGG484I

IC FPGA 223 I/O 484FBGA

Microchip Technology

1,602 672.82
AFS1500-FGG484I

数据手册

Fusion® 484-BGA Tray Active Not Verified - - 276480 223 1500000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 484-FPBGA (23x23)
M1AFS1500-FGG484I

M1AFS1500-FGG484I

IC FPGA 223 I/O 484FBGA

Microchip Technology

2,302 672.82
M1AFS1500-FGG484I

数据手册

Fusion® 484-BGA Tray Active Not Verified - - 276480 223 1500000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 484-FPBGA (23x23)