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制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
AGLE3000V5-FGG484I

AGLE3000V5-FGG484I

IC FPGA 341 I/O 484FBGA

Microchip Technology

2,505 823.41
AGLE3000V5-FGG484I

数据手册

IGLOOe 484-BGA Tray Active Not Verified - 75264 516096 341 3000000 1.425V ~ 1.575V Surface Mount -40°C ~ 85°C (TA) - - 484-FPBGA (23x23)
M1AGLE3000V5-FG484I

M1AGLE3000V5-FG484I

IC FPGA 341 I/O 484FBGA

Microchip Technology

2,797 823.41
M1AGLE3000V5-FG484I

数据手册

IGLOOe 484-BGA Tray Active Not Verified - 75264 516096 341 3000000 1.425V ~ 1.575V Surface Mount -40°C ~ 85°C (TA) - - 484-FPBGA (23x23)
M1AGLE3000V5-FGG484I

M1AGLE3000V5-FGG484I

IC FPGA 341 I/O 484FBGA

Microchip Technology

1,469 823.41
M1AGLE3000V5-FGG484I

数据手册

IGLOOe 484-BGA Tray Active Not Verified - 75264 516096 341 3000000 1.425V ~ 1.575V Surface Mount -40°C ~ 85°C (TA) - - 484-FPBGA (23x23)
APA600-FG256A

APA600-FG256A

IC FPGA 186 I/O 256FBGA

Microchip Technology

1,955 851.08
APA600-FG256A

数据手册

ProASICPLUS 256-LBGA Tray Active Not Verified - - 129024 186 600000 2.375V ~ 2.625V Surface Mount -40°C ~ 125°C (TJ) - - 256-FPBGA (17x17)
APA600-FGG256A

APA600-FGG256A

IC FPGA 186 I/O 256FBGA

Microchip Technology

4,369 851.08
APA600-FGG256A

数据手册

ProASICPLUS 256-LBGA Tray Active Not Verified - - 129024 186 600000 2.375V ~ 2.625V Surface Mount -40°C ~ 125°C (TJ) - - 256-FPBGA (17x17)
A42MX09-1TQG176M

A42MX09-1TQG176M

IC FPGA 104 I/O 176TQFP

Microchip Technology

2,022 830.54
A42MX09-1TQG176M

数据手册

MX 176-LQFP Tray Active Not Verified - - - 104 14000 3V ~ 3.6V, 4.5V ~ 5.5V Surface Mount -55°C ~ 125°C (TC) - - 176-TQFP (24x24)
A42MX16-1PQG100M

A42MX16-1PQG100M

IC FPGA 83 I/O 100QFP

Microchip Technology

2,734 830.54
A42MX16-1PQG100M

数据手册

MX 100-BQFP Tray Active Not Verified - - - 83 24000 3V ~ 3.6V, 4.5V ~ 5.5V Surface Mount -55°C ~ 125°C (TC) - - 100-PQFP (20x14)
A42MX36-2PQG208

A42MX36-2PQG208

IC FPGA 176 I/O 208QFP

Microchip Technology

2,325 833.41
A42MX36-2PQG208

数据手册

MX 208-BFQFP Tray Active Not Verified - - 2560 176 54000 3V ~ 3.6V, 4.75V ~ 5.25V Surface Mount 0°C ~ 70°C (TA) - - 208-PQFP (28x28)
MPF500TL-FCG784I

MPF500TL-FCG784I

IC FPGA 388 I/O 784FCBGA

Microchip Technology

3,140 950.22
MPF500TL-FCG784I

数据手册

PolarFire™ 784-BBGA, FCBGA Tray Active Not Verified - 481000 33792000 388 - 0.97V ~ 1.08V Surface Mount -40°C ~ 100°C (TJ) - - 784-FCBGA (29x29)
AX1000-1FG676I

AX1000-1FG676I

IC FPGA 418 I/O 676FBGA

Microchip Technology

3,727 838.39
AX1000-1FG676I

数据手册

Axcelerator 676-BGA Tray Active Not Verified 18144 - 165888 418 1000000 1.425V ~ 1.575V Surface Mount -40°C ~ 85°C (TA) - - 676-FBGA (27x27)