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制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
A3PE3000L-FGG484I

A3PE3000L-FGG484I

IC FPGA 341 I/O 484FBGA

Microchip Technology

1,141 923.76
A3PE3000L-FGG484I

数据手册

ProASIC3L 484-BGA Tray Active Not Verified - - 516096 341 3000000 1.14V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 484-FPBGA (23x23)
M1A3PE3000L-FG484I

M1A3PE3000L-FG484I

IC FPGA 341 I/O 484FBGA

Microchip Technology

2,931 923.76
M1A3PE3000L-FG484I

数据手册

ProASIC3L 484-BGA Tray Active Not Verified - - 516096 341 3000000 1.14V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 484-FPBGA (23x23)
AX250-PQG208M

AX250-PQG208M

IC FPGA 115 I/O 208QFP

Microchip Technology

2,775 932.73
AX250-PQG208M

数据手册

Axcelerator 208-BFQFP Tray Active Not Verified 4224 - 55296 115 250000 1.425V ~ 1.575V Surface Mount -55°C ~ 125°C (TA) - - 208-PQFP (28x28)
A42MX36-3PQG208

A42MX36-3PQG208

IC FPGA 176 I/O 208QFP

Microchip Technology

2,943 933.48
A42MX36-3PQG208

数据手册

MX 208-BFQFP Tray Active Not Verified - - 2560 176 54000 3V ~ 3.6V, 4.75V ~ 5.25V Surface Mount 0°C ~ 70°C (TA) - - 208-PQFP (28x28)
A42MX36-2PQG208I

A42MX36-2PQG208I

IC FPGA 176 I/O 208QFP

Microchip Technology

4,756 933.48
A42MX36-2PQG208I

数据手册

MX 208-BFQFP Tray Active Not Verified - - 2560 176 54000 3V ~ 3.6V, 4.5V ~ 5.5V Surface Mount -40°C ~ 85°C (TA) - - 208-PQFP (28x28)
A42MX16-1PQG208M

A42MX16-1PQG208M

IC FPGA 140 I/O 208QFP

Microchip Technology

3,537 937.86
A42MX16-1PQG208M

数据手册

MX 208-BFQFP Tray Active Not Verified - - - 140 24000 3V ~ 3.6V, 4.5V ~ 5.5V Surface Mount -55°C ~ 125°C (TC) - - 208-PQFP (28x28)
A54SX32A-PQG208M

A54SX32A-PQG208M

IC FPGA 174 I/O 208QFP

Microchip Technology

3,788 952.01
A54SX32A-PQG208M

数据手册

SX-A 208-BFQFP Tray Active Not Verified 2880 - - 174 48000 2.25V ~ 5.25V Surface Mount -55°C ~ 125°C (TC) - - 208-PQFP (28x28)
A42MX16-1TQG176M

A42MX16-1TQG176M

IC FPGA 140 I/O 176TQFP

Microchip Technology

3,647 969.79
A42MX16-1TQG176M

数据手册

MX 176-LQFP Tray Active Not Verified - - - 140 24000 3V ~ 3.6V, 4.5V ~ 5.5V Surface Mount -55°C ~ 125°C (TC) - - 176-TQFP (24x24)
A54SX16P-PQG208M

A54SX16P-PQG208M

IC FPGA 175 I/O 208QFP

Microchip Technology

4,662 978.72
A54SX16P-PQG208M

数据手册

SX 208-BFQFP Tray Active Not Verified 1452 - - 175 24000 3V ~ 3.6V, 4.75V ~ 5.25V Surface Mount -55°C ~ 125°C (TC) - - 208-PQFP (28x28)
A42MX36-1BG272I

A42MX36-1BG272I

IC FPGA 202 I/O 272BGA

Microchip Technology

2,371 996.62
A42MX36-1BG272I

数据手册

MX 272-BBGA Tray Active Not Verified - - 2560 202 54000 3V ~ 3.6V, 4.5V ~ 5.5V Surface Mount -40°C ~ 85°C (TA) - - 272-PBGA (27x27)