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制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
A54SX32A-FG256M

A54SX32A-FG256M

IC FPGA 203 I/O 256FBGA

Microchip Technology

4,925 1003.22
A54SX32A-FG256M

数据手册

SX-A 256-BGA Tray Active Not Verified 2880 - - 203 48000 2.25V ~ 5.25V Surface Mount -55°C ~ 125°C (TC) - - 256-FPBGA (17x17)
A54SX32A-FGG256M

A54SX32A-FGG256M

IC FPGA 203 I/O 256FBGA

Microchip Technology

4,685 1003.22
A54SX32A-FGG256M

数据手册

SX-A 256-BGA Tray Active Not Verified 2880 - - 203 48000 2.25V ~ 5.25V Surface Mount -55°C ~ 125°C (TC) - - 256-FPBGA (17x17)
A3PE3000L-FG896I

A3PE3000L-FG896I

IC FPGA 620 I/O 896FBGA

Microchip Technology

4,028 1001.00
A3PE3000L-FG896I

数据手册

ProASIC3L 896-BGA Tray Active Not Verified - - 516096 620 3000000 1.14V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 896-FBGA (31x31)
M1A3PE3000L-FGG896I

M1A3PE3000L-FGG896I

IC FPGA 620 I/O 896FBGA

Microchip Technology

1,553 1001.00
M1A3PE3000L-FGG896I

数据手册

ProASIC3L 896-BGA Tray Active Not Verified - - 516096 620 3000000 1.14V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 896-FBGA (31x31)
APA600-FGG256M

APA600-FGG256M

IC FPGA 186 I/O 256FBGA

Microchip Technology

2,005 1047.05
APA600-FGG256M

数据手册

ProASICPLUS 256-LBGA Tray Active Not Verified - - 129024 186 600000 2.3V ~ 2.7V Surface Mount -55°C ~ 125°C (TC) - - 256-FPBGA (17x17)
AX1000-2FGG676I

AX1000-2FGG676I

IC FPGA 418 I/O 676FBGA

Microchip Technology

3,005 1035.71
AX1000-2FGG676I

数据手册

Axcelerator 676-BGA Tray Active Not Verified 18144 - 165888 418 1000000 1.425V ~ 1.575V Surface Mount -40°C ~ 85°C (TA) - - 676-FBGA (27x27)
A42MX36-3PQG208I

A42MX36-3PQG208I

IC FPGA 176 I/O 208QFP

Microchip Technology

4,008 1033.90
A42MX36-3PQG208I

数据手册

MX 208-BFQFP Tray Active Not Verified - - 2560 176 54000 3V ~ 3.6V, 4.5V ~ 5.5V Surface Mount -40°C ~ 85°C (TA) - - 208-PQFP (28x28)
MPF500TLS-FCG784I

MPF500TLS-FCG784I

IC FPGA 388 I/O 784FCBGA

Microchip Technology

2,028 1085.97
MPF500TLS-FCG784I

数据手册

PolarFire™ 784-BBGA, FCBGA Tray Active Not Verified - 481000 33792000 388 - 0.97V ~ 1.08V Surface Mount -40°C ~ 100°C (TJ) - - 784-FCBGA (29x29)
MPF500TS-1FCG784I

MPF500TS-1FCG784I

IC FPGA 388 I/O 784FCBGA

Microchip Technology

1,117 1085.97
MPF500TS-1FCG784I

数据手册

PolarFire™ 784-BBGA, FCBGA Tray Active Not Verified - 481000 33792000 388 - 0.97V ~ 1.08V Surface Mount -40°C ~ 100°C (TJ) - - 784-FCBGA (29x29)
AX1000-2FG484I

AX1000-2FG484I

IC FPGA 317 I/O 484FBGA

Microchip Technology

2,213 1053.96
AX1000-2FG484I

数据手册

Axcelerator 484-BGA Tray Active Not Verified 18144 - 165888 317 1000000 1.425V ~ 1.575V Surface Mount -40°C ~ 85°C (TA) - - 484-FPBGA (23x23)