产品中心

制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
AX1000-2FGG484I

AX1000-2FGG484I

IC FPGA 317 I/O 484FBGA

Microchip Technology

4,899 1053.96
AX1000-2FGG484I

数据手册

Axcelerator 484-BGA Tray Active Not Verified 18144 - 165888 317 1000000 1.425V ~ 1.575V Surface Mount -40°C ~ 85°C (TA) - - 484-FPBGA (23x23)
M1A3PE3000L-1PQG208I

M1A3PE3000L-1PQG208I

IC FPGA 147 I/O 208QFP

Microchip Technology

2,030 1051.27
M1A3PE3000L-1PQG208I

数据手册

ProASIC3L 208-BFQFP Tray Active Not Verified - - 516096 147 3000000 1.14V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 208-PQFP (28x28)
APA600-BG456M

APA600-BG456M

IC FPGA 356 I/O 456BGA

Microchip Technology

3,079 1072.22
APA600-BG456M

数据手册

ProASICPLUS 456-BBGA Tray Active Not Verified - - 129024 356 600000 2.3V ~ 2.7V Surface Mount -55°C ~ 125°C (TC) - - 456-PBGA (35x35)
APA600-BGG456M

APA600-BGG456M

IC FPGA 356 I/O 456BGA

Microchip Technology

4,306 1072.22
APA600-BGG456M

数据手册

ProASICPLUS 456-BBGA Tray Active Not Verified - - 129024 356 600000 2.3V ~ 2.7V Surface Mount -55°C ~ 125°C (TC) - - 456-PBGA (35x35)
AX2000-FGG896

AX2000-FGG896

IC FPGA 586 I/O 896FBGA

Microchip Technology

4,491 1064.22
AX2000-FGG896

数据手册

Axcelerator 896-BGA Tray Active Not Verified 32256 - 294912 586 2000000 1.425V ~ 1.575V Surface Mount 0°C ~ 70°C (TA) - - 896-FBGA (31x31)
A3PE3000L-1FGG484I

A3PE3000L-1FGG484I

IC FPGA 341 I/O 484FBGA

Microchip Technology

1,862 1079.47
A3PE3000L-1FGG484I

数据手册

ProASIC3L 484-BGA Tray Active Not Verified - - 516096 341 3000000 1.14V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 484-FPBGA (23x23)
A3PE3000L-1FG484I

A3PE3000L-1FG484I

IC FPGA 341 I/O 484FBGA

Microchip Technology

2,878 1079.47
A3PE3000L-1FG484I

数据手册

ProASIC3L 484-BGA Tray Active Not Verified - - 516096 341 3000000 1.14V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 484-FPBGA (23x23)
M1A3PE3000L-1FG484I

M1A3PE3000L-1FG484I

IC FPGA 341 I/O 484FBGA

Microchip Technology

3,806 1079.47
M1A3PE3000L-1FG484I

数据手册

ProASIC3L 484-BGA Tray Active Not Verified - - 516096 341 3000000 1.14V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 484-FPBGA (23x23)
M1A3PE3000L-1FGG484I

M1A3PE3000L-1FGG484I

IC FPGA 341 I/O 484FBGA

Microchip Technology

1,394 1079.47
M1A3PE3000L-1FGG484I

数据手册

ProASIC3L 484-BGA Tray Active Not Verified - - 516096 341 3000000 1.14V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 484-FPBGA (23x23)
AX250-FG256M

AX250-FG256M

IC FPGA 138 I/O 256FBGA

Microchip Technology

1,082 1106.42
AX250-FG256M

数据手册

Axcelerator 256-LBGA Tray Active Not Verified 4224 - 55296 138 250000 1.425V ~ 1.575V Surface Mount -55°C ~ 125°C (TA) - - 256-FPBGA (17x17)