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制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
A54SX32-1CQ208B

A54SX32-1CQ208B

IC FPGA 174 I/O 208CQFP

Microchip Technology

4,680 12520.04
A54SX32-1CQ208B

数据手册

SX 208-BFCQFP with Tie Bar Bulk Active Not Verified 2880 - - 174 48000 3V ~ 3.6V, 4.75V ~ 5.25V Surface Mount -55°C ~ 125°C (TJ) - - 208-CQFP (75x75)
5962-9958602QYC

5962-9958602QYC

IC FPGA 174 I/O 208CQFP

Microchip Technology

3,289 12520.04
5962-9958602QYC

数据手册

SX 208-BFCQFP with Tie Bar Bulk Active Not Verified 2880 - - 174 48000 3V ~ 3.6V, 4.75V ~ 5.25V Surface Mount -55°C ~ 125°C (TJ) - - 208-CQFP (75x75)
5962-0151802QXC

5962-0151802QXC

IC FPGA 203 I/O 256CQFP

Microchip Technology

2,392 13428.07
5962-0151802QXC

数据手册

SX-A 256-BFCQFP with Tie Bar Bulk Active Not Verified 2880 - - 203 48000 2.25V ~ 5.25V Surface Mount -55°C ~ 125°C (TJ) - - 256-CQFP (75x75)
A54SX72A-CQ208B

A54SX72A-CQ208B

IC FPGA 171 I/O 208CQFP

Microchip Technology

1,747 13633.26
A54SX72A-CQ208B

数据手册

SX-A 208-BFCQFP with Tie Bar Bulk Active Not Verified 6036 - - 171 108000 2.25V ~ 5.25V Surface Mount -55°C ~ 125°C (TJ) - - 208-CQFP (75x75)
APA600-CGS624B

APA600-CGS624B

IC FPGA 440 I/O 624CCGA

Microchip Technology

4,389 14283.67
APA600-CGS624B

数据手册

ProASICPLUS 624-BCCGA Bulk Active Not Verified - - 129024 440 600000 2.3V ~ 2.7V Through Hole -55°C ~ 125°C (TJ) - - 624-CCGA (32.5x32.5)
AX2000-CQ352M

AX2000-CQ352M

IC FPGA 198 I/O 352CQFP

Microchip Technology

4,295 15123.13
AX2000-CQ352M

数据手册

Axcelerator 352-BFCQFP with Tie Bar Tray Active Not Verified 32256 - 294912 198 2000000 1.425V ~ 1.575V Surface Mount -55°C ~ 125°C (TA) - - 352-CQFP (75x75)
AX2000-LG624M

AX2000-LG624M

IC FPGA 418 I/O 624CLGA

Microchip Technology

1,585 15123.13
AX2000-LG624M

数据手册

Axcelerator 624-BCLGA Tray Active Not Verified 32256 - 294912 418 2000000 1.425V ~ 1.575V Surface Mount -55°C ~ 125°C (TA) - - 624-CLGA (32.5x32.5)
A54SX72A-CQ256B

A54SX72A-CQ256B

IC FPGA 203 I/O 256CQFP

Microchip Technology

1,634 15666.57
A54SX72A-CQ256B

数据手册

SX-A 256-BFCQFP with Tie Bar Bulk Active Not Verified 6036 - - 203 108000 2.25V ~ 5.25V Surface Mount -55°C ~ 125°C (TJ) - - 256-CQFP (75x75)
A54SX72A-1CQ208B

A54SX72A-1CQ208B

IC FPGA 171 I/O 208CQFP

Microchip Technology

3,422 16359.74
A54SX72A-1CQ208B

数据手册

SX-A 208-BFCQFP with Tie Bar Bulk Active Not Verified 6036 - - 171 108000 2.25V ~ 5.25V Surface Mount -55°C ~ 125°C (TJ) - - 208-CQFP (75x75)
APA1000-CQ208M

APA1000-CQ208M

IC FPGA 158 I/O 208CQFP

Microchip Technology

4,354 18036.45
APA1000-CQ208M

数据手册

ProASICPLUS 208-BFCQFP with Tie Bar Tray Active Not Verified - - 202752 158 1000000 2.3V ~ 2.7V Surface Mount -55°C ~ 125°C (TC) - - 208-CQFP (75x75)