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制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
5962-9958501QYC

5962-9958501QYC

IC FPGA 176 I/O 208CQFP

Microchip Technology

1,194 8642.42
5962-9958501QYC

数据手册

MX 208-BFCQFP with Tie Bar Bulk Active Not Verified - - 2560 176 54000 3V ~ 3.6V, 4.5V ~ 5.5V Surface Mount -55°C ~ 125°C (TJ) - - 208-CQFP (75x75)
A54SX32A-1CQ256M

A54SX32A-1CQ256M

IC FPGA 228 I/O 256CQFP

Microchip Technology

4,575 8678.13
A54SX32A-1CQ256M

数据手册

SX-A 256-BFCQFP with Tie Bar Tray Active Not Verified 2880 - - 228 48000 2.25V ~ 5.25V Surface Mount -55°C ~ 125°C (TC) - - 256-CQFP (75x75)
A54SX72A-CQ208M

A54SX72A-CQ208M

IC FPGA 171 I/O 208CQFP

Microchip Technology

1,556 8791.13
A54SX72A-CQ208M

数据手册

SX-A 208-BFCQFP with Tie Bar Tray Active Not Verified 6036 - - 171 108000 2.25V ~ 5.25V Surface Mount -55°C ~ 125°C (TC) - - 208-CQFP (75x75)
AX2000-1FG896M

AX2000-1FG896M

IC FPGA 586 I/O 896FBGA

Microchip Technology

4,170 9045.31
AX2000-1FG896M

数据手册

Axcelerator 896-BGA Tray Active Not Verified 32256 - 294912 586 2000000 1.425V ~ 1.575V Surface Mount -55°C ~ 125°C (TA) - - 896-FBGA (31x31)
AX2000-1FGG896M

AX2000-1FGG896M

IC FPGA 586 I/O 896FBGA

Microchip Technology

2,214 9045.31
AX2000-1FGG896M

数据手册

Axcelerator 896-BGA Tray Active Not Verified 32256 - 294912 586 2000000 1.425V ~ 1.575V Surface Mount -55°C ~ 125°C (TA) - - 896-FBGA (31x31)
A54SX32A-1CQ84B

A54SX32A-1CQ84B

IC FPGA 69 I/O 84CQFP

Microchip Technology

4,276 9345.90
A54SX32A-1CQ84B

数据手册

SX-A 84-CQFP Exposed Pad and Tie Bar Bulk Active Not Verified 2880 - - 69 48000 2.25V ~ 5.25V Surface Mount -55°C ~ 125°C (TJ) - - 84-CQFP (42x42)
A42MX36-CQ256B

A42MX36-CQ256B

IC FPGA 202 I/O 256CQFP

Microchip Technology

3,214 9609.36
A42MX36-CQ256B

数据手册

MX 256-BFCQFP with Tie Bar Bulk Active Not Verified - - 2560 202 54000 3V ~ 3.6V, 4.5V ~ 5.5V Surface Mount -55°C ~ 125°C (TJ) - - 256-CQFP (75x75)
A54SX32A-CQ208B

A54SX32A-CQ208B

IC FPGA 174 I/O 208CQFP

Microchip Technology

2,109 9741.06
A54SX32A-CQ208B

数据手册

SX-A 208-BFCQFP with Tie Bar Bulk Active Not Verified 2880 - - 174 48000 2.25V ~ 5.25V Surface Mount -55°C ~ 125°C (TJ) - - 208-CQFP (75x75)
5962-0151801QYC

5962-0151801QYC

IC FPGA 174 I/O 208CQFP

Microchip Technology

3,762 9741.06
5962-0151801QYC

数据手册

SX-A 208-BFCQFP with Tie Bar Bulk Active Not Verified 2880 - - 174 48000 2.25V ~ 5.25V Surface Mount -55°C ~ 125°C (TJ) - - 208-CQFP (75x75)
A54SX72A-CQ256M

A54SX72A-CQ256M

IC FPGA 213 I/O 256CQFP

Microchip Technology

3,637 10126.31
A54SX72A-CQ256M

数据手册

SX-A 256-BFCQFP with Tie Bar Tray Active Not Verified 6036 - - 213 108000 2.25V ~ 5.25V Surface Mount -55°C ~ 125°C (TC) - - 256-CQFP (75x75)