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制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
A54SX32A-CQ208

A54SX32A-CQ208

IC FPGA 174 I/O 208CQFP

Microchip Technology

1,845 4175.41
A54SX32A-CQ208

数据手册

SX-A 208-BFCQFP with Tie Bar Bulk Active Not Verified 2880 - - 174 48000 2.25V ~ 5.25V Surface Mount 0°C ~ 70°C (TA) - - 208-CQFP (75x75)
AX1000-1FG484M

AX1000-1FG484M

IC FPGA 317 I/O 484FBGA

Microchip Technology

2,761 4266.02
AX1000-1FG484M

数据手册

Axcelerator 484-BGA Tray Active Not Verified 18144 - 165888 317 1000000 1.425V ~ 1.575V Surface Mount -55°C ~ 125°C (TA) - - 484-FPBGA (23x23)
AX1000-1FGG484M

AX1000-1FGG484M

IC FPGA 317 I/O 484FBGA

Microchip Technology

1,329 4266.02
AX1000-1FGG484M

数据手册

Axcelerator 484-BGA Tray Active Not Verified 18144 - 165888 317 1000000 1.425V ~ 1.575V Surface Mount -55°C ~ 125°C (TA) - - 484-FPBGA (23x23)
AX1000-1FG896M

AX1000-1FG896M

IC FPGA 516 I/O 896FBGA

Microchip Technology

2,406 4288.80
AX1000-1FG896M

数据手册

Axcelerator 896-BGA Tray Active Not Verified 18144 - 165888 516 1000000 1.425V ~ 1.575V Surface Mount -55°C ~ 125°C (TA) - - 896-FBGA (31x31)
AX1000-1FGG896M

AX1000-1FGG896M

IC FPGA 516 I/O 896FBGA

Microchip Technology

2,383 4288.80
AX1000-1FGG896M

数据手册

Axcelerator 896-BGA Tray Active Not Verified 18144 - 165888 516 1000000 1.425V ~ 1.575V Surface Mount -55°C ~ 125°C (TA) - - 896-FBGA (31x31)
A42MX36-1CQ208

A42MX36-1CQ208

IC FPGA 176 I/O 208CQFP

Microchip Technology

1,886 4518.84
A42MX36-1CQ208

数据手册

MX 208-BFCQFP with Tie Bar Bulk Active Not Verified - - 2560 176 54000 3V ~ 3.6V, 4.75V ~ 5.25V Surface Mount 0°C ~ 70°C (TA) - - 208-CQFP (75x75)
A42MX16-PG176B

A42MX16-PG176B

IC FPGA 140 I/O 176CPGA

Microchip Technology

2,931 4654.70
A42MX16-PG176B

数据手册

MX 176-BCPGA Tray Active Not Verified - 608 - 140 24000 3V ~ 3.6V, 4.75V ~ 5.25V Through Hole -55°C ~ 125°C (TC) - - 176-CPGA (39.88x39.88)
A54SX32A-1CQ208

A54SX32A-1CQ208

IC FPGA 174 I/O 208CQFP

Microchip Technology

3,512 5011.61
A54SX32A-1CQ208

数据手册

SX-A 208-BFCQFP with Tie Bar Bulk Active Not Verified 2880 - - 174 48000 2.25V ~ 5.25V Surface Mount 0°C ~ 70°C (TA) - - 208-CQFP (75x75)
A42MX36-1CQ256

A42MX36-1CQ256

IC FPGA 202 I/O 256CQFP

Microchip Technology

1,921 5026.62
A42MX36-1CQ256

数据手册

MX 256-BFCQFP with Tie Bar Bulk Active Not Verified - - 2560 202 54000 3V ~ 3.6V, 4.75V ~ 5.25V Surface Mount 0°C ~ 70°C (TA) - - 256-CQFP (75x75)
A54SX32A-CQ84M

A54SX32A-CQ84M

IC FPGA 69 I/O 84CQFP

Microchip Technology

3,914 5032.45
A54SX32A-CQ84M

数据手册

SX-A 84-CQFP Exposed Pad and Tie Bar Tray Active Not Verified 2880 - - 69 48000 2.25V ~ 5.25V Surface Mount -55°C ~ 125°C (TC) - - 84-CQFP (42x42)