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制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
A54SX72A-FGG484M

A54SX72A-FGG484M

IC FPGA 360 I/O 484FBGA

Microchip Technology

3,997 3092.88
A54SX72A-FGG484M

数据手册

SX-A 484-BGA Tray Active Not Verified 6036 - - 360 108000 2.25V ~ 5.25V Surface Mount -55°C ~ 125°C (TC) - - 484-FPBGA (27X27)
A54SX72A-FG484M

A54SX72A-FG484M

IC FPGA 360 I/O 484FBGA

Microchip Technology

1,438 3092.88
A54SX72A-FG484M

数据手册

SX-A 484-BGA Tray Active Not Verified 6036 - - 360 108000 2.25V ~ 5.25V Surface Mount -55°C ~ 125°C (TC) - - 484-FPBGA (27X27)
APA1000-BGG456I

APA1000-BGG456I

IC FPGA 356 I/O 456BGA

Microchip Technology

4,609 3154.68
APA1000-BGG456I

数据手册

ProASICPLUS 456-BBGA Tray Active Not Verified - - 202752 356 1000000 2.3V ~ 2.7V Surface Mount -40°C ~ 85°C (TA) - - 456-PBGA (35x35)
APA1000-BG456I

APA1000-BG456I

IC FPGA 356 I/O 456BGA

Microchip Technology

2,027 3154.68
APA1000-BG456I

数据手册

ProASICPLUS 456-BBGA Tray Active Not Verified - - 202752 356 1000000 2.3V ~ 2.7V Surface Mount -40°C ~ 85°C (TA) - - 456-PBGA (35x35)
APA1000-FGG896I

APA1000-FGG896I

IC FPGA 642 I/O 896FBGA

Microchip Technology

4,556 3172.56
APA1000-FGG896I

数据手册

ProASICPLUS 896-BGA Tray Active Not Verified - - 202752 642 1000000 2.3V ~ 2.7V Surface Mount -40°C ~ 85°C (TA) - - 896-FBGA (31x31)
A54SX72A-1PQG208M

A54SX72A-1PQG208M

IC FPGA 171 I/O 208QFP

Microchip Technology

4,395 3142.86
A54SX72A-1PQG208M

数据手册

SX-A 208-BFQFP Tray Active Not Verified 6036 - - 171 108000 2.25V ~ 5.25V Surface Mount -55°C ~ 125°C (TC) - - 208-PQFP (28x28)
AX1000-FG676M

AX1000-FG676M

IC FPGA 418 I/O 676FBGA

Microchip Technology

4,472 3205.22
AX1000-FG676M

数据手册

Axcelerator 676-BGA Tray Active Not Verified 18144 - 165888 418 1000000 1.425V ~ 1.575V Surface Mount -55°C ~ 125°C (TA) - - 676-FBGA (27x27)
AX1000-FGG676M

AX1000-FGG676M

IC FPGA 418 I/O 676FBGA

Microchip Technology

4,843 3205.22
AX1000-FGG676M

数据手册

Axcelerator 676-BGA Tray Active Not Verified 18144 - 165888 418 1000000 1.425V ~ 1.575V Surface Mount -55°C ~ 125°C (TA) - - 676-FBGA (27x27)
AX1000-FG484M

AX1000-FG484M

IC FPGA 317 I/O 484FBGA

Microchip Technology

2,658 3262.24
AX1000-FG484M

数据手册

Axcelerator 484-BGA Tray Active Not Verified 18144 - 165888 317 1000000 1.425V ~ 1.575V Surface Mount -55°C ~ 125°C (TA) - - 484-FPBGA (23x23)
AX1000-FGG484M

AX1000-FGG484M

IC FPGA 317 I/O 484FBGA

Microchip Technology

4,363 3262.24
AX1000-FGG484M

数据手册

Axcelerator 484-BGA Tray Active Not Verified 18144 - 165888 317 1000000 1.425V ~ 1.575V Surface Mount -55°C ~ 125°C (TA) - - 484-FPBGA (23x23)