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制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
APA1000-FG896M

APA1000-FG896M

IC FPGA 642 I/O 896FBGA

Microchip Technology

3,961 3812.12
APA1000-FG896M

数据手册

ProASICPLUS 896-BGA Tray Active Not Verified - - 202752 642 1000000 2.3V ~ 2.7V Surface Mount -55°C ~ 125°C (TC) - - 896-FBGA (31x31)
A42MX36-CQ208

A42MX36-CQ208

IC FPGA 176 I/O 208CQFP

Microchip Technology

2,355 3766.09
A42MX36-CQ208

数据手册

MX 208-BFCQFP with Tie Bar Bulk Active Not Verified - - 2560 176 54000 3V ~ 3.6V, 4.75V ~ 5.25V Surface Mount 0°C ~ 70°C (TA) - - 208-CQFP (75x75)
APA300-CQ208B

APA300-CQ208B

IC FPGA 158 I/O 208CQFP

Microchip Technology

2,131 3982.56
APA300-CQ208B

数据手册

ProASICPLUS 208-BFCQFP with Tie Bar Bulk Active Not Verified - - 73728 158 300000 2.3V ~ 2.7V Surface Mount -55°C ~ 125°C (TJ) - - 208-CQFP (75x75)
A54SX72A-1FG256M

A54SX72A-1FG256M

IC FPGA 203 I/O 256FBGA

Microchip Technology

1,819 3937.30
A54SX72A-1FG256M

数据手册

SX-A 256-BGA Tray Active Not Verified 6036 - - 203 108000 2.25V ~ 5.25V Surface Mount -55°C ~ 125°C (TC) - - 256-FPBGA (17x17)
A54SX72A-1FGG256M

A54SX72A-1FGG256M

IC FPGA 203 I/O 256FBGA

Microchip Technology

2,240 3937.30
A54SX72A-1FGG256M

数据手册

SX-A 256-BGA Tray Active Not Verified 6036 - - 203 108000 2.25V ~ 5.25V Surface Mount -55°C ~ 125°C (TC) - - 256-FPBGA (17x17)
A54SX32A-1CQ84

A54SX32A-1CQ84

IC FPGA 69 I/O 84CQFP

Microchip Technology

2,444 4005.55
A54SX32A-1CQ84

数据手册

SX-A 84-CQFP Exposed Pad and Tie Bar Bulk Active Not Verified 2880 - - 69 48000 2.25V ~ 5.25V Surface Mount 0°C ~ 70°C (TA) - - 84-CQFP (42x42)
A54SX72A-1FG484M

A54SX72A-1FG484M

IC FPGA 360 I/O 484FBGA

Microchip Technology

1,624 4120.61
A54SX72A-1FG484M

数据手册

SX-A 484-BGA Tray Active Not Verified 6036 - - 360 108000 2.25V ~ 5.25V Surface Mount -55°C ~ 125°C (TC) - - 484-FPBGA (27X27)
A54SX72A-1FGG484M

A54SX72A-1FGG484M

IC FPGA 360 I/O 484FBGA

Microchip Technology

3,437 4120.61
A54SX72A-1FGG484M

数据手册

SX-A 484-BGA Tray Active Not Verified 6036 - - 360 108000 2.25V ~ 5.25V Surface Mount -55°C ~ 125°C (TC) - - 484-FPBGA (27X27)
AX1000-1FG676M

AX1000-1FG676M

IC FPGA 418 I/O 676FBGA

Microchip Technology

4,077 4191.86
AX1000-1FG676M

数据手册

Axcelerator 676-BGA Tray Active Not Verified 18144 - 165888 418 1000000 1.425V ~ 1.575V Surface Mount -55°C ~ 125°C (TA) - - 676-FBGA (27x27)
AX1000-1FGG676M

AX1000-1FGG676M

IC FPGA 418 I/O 676FBGA

Microchip Technology

2,215 4191.86
AX1000-1FGG676M

数据手册

Axcelerator 676-BGA Tray Active Not Verified 18144 - 165888 418 1000000 1.425V ~ 1.575V Surface Mount -55°C ~ 125°C (TA) - - 676-FBGA (27x27)