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制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
AX1000-FG896M

AX1000-FG896M

IC FPGA 516 I/O 896FBGA

Microchip Technology

3,759 3279.34
AX1000-FG896M

数据手册

Axcelerator 896-BGA Tray Active Not Verified 18144 - 165888 516 1000000 1.425V ~ 1.575V Surface Mount -55°C ~ 125°C (TA) - - 896-FBGA (31x31)
AX1000-FGG896M

AX1000-FGG896M

IC FPGA 516 I/O 896FBGA

Microchip Technology

4,557 3279.34
AX1000-FGG896M

数据手册

Axcelerator 896-BGA Tray Active Not Verified 18144 - 165888 516 1000000 1.425V ~ 1.575V Surface Mount -55°C ~ 125°C (TA) - - 896-FBGA (31x31)
APA1000-PQG208A

APA1000-PQG208A

IC FPGA 158 I/O 208QFP

Microchip Technology

3,939 3412.26
APA1000-PQG208A

数据手册

ProASICPLUS 208-BFQFP Tray Active Not Verified - - 202752 158 1000000 2.375V ~ 2.625V Surface Mount -40°C ~ 125°C (TJ) - - 208-PQFP (28x28)
A54SX32A-CQ84

A54SX32A-CQ84

IC FPGA 69 I/O 84CQFP

Microchip Technology

2,667 3338.14
A54SX32A-CQ84

数据手册

SX-A 84-CQFP Exposed Pad and Tie Bar Bulk Active Not Verified 2880 - - 69 48000 2.25V ~ 5.25V Surface Mount 0°C ~ 70°C (TA) - - 84-CQFP (42x42)
APA1000-PQG208M

APA1000-PQG208M

IC FPGA 158 I/O 208QFP

Microchip Technology

1,503 3408.30
APA1000-PQG208M

数据手册

ProASICPLUS 208-BFQFP Tray Active Not Verified - - 202752 158 1000000 2.3V ~ 2.7V Surface Mount -55°C ~ 125°C (TC) - - 208-PQFP (28x28)
APA1000-FG896A

APA1000-FG896A

IC FPGA 642 I/O 896FBGA

Microchip Technology

1,791 3489.54
APA1000-FG896A

数据手册

ProASICPLUS 896-BGA Tray Active Not Verified - - 202752 642 1000000 2.375V ~ 2.625V Surface Mount -40°C ~ 125°C (TJ) - - 896-FBGA (31x31)
APA1000-FGG896A

APA1000-FGG896A

IC FPGA 642 I/O 896FBGA

Microchip Technology

1,718 3489.54
APA1000-FGG896A

数据手册

ProASICPLUS 896-BGA Tray Active Not Verified - - 202752 642 1000000 2.375V ~ 2.625V Surface Mount -40°C ~ 125°C (TJ) - - 896-FBGA (31x31)
A42MX09-PG132B

A42MX09-PG132B

IC FPGA 95 I/O 132CPGA

Microchip Technology

1,449 3638.68
A42MX09-PG132B

数据手册

MX - Tray Active Not Verified - - - 95 14000 3V ~ 3.6V, 4.5V ~ 5.5V Surface Mount -55°C ~ 125°C (TJ) - - 132-CPGA
APA1000-BGG456M

APA1000-BGG456M

IC FPGA 356 I/O 456BGA

Microchip Technology

1,932 3791.26
APA1000-BGG456M

数据手册

ProASICPLUS 456-BBGA Tray Active Not Verified - - 202752 356 1000000 2.3V ~ 2.7V Surface Mount -55°C ~ 125°C (TC) - - 456-PBGA (35x35)
APA1000-BG456M

APA1000-BG456M

IC FPGA 356 I/O 456BGA

Microchip Technology

1,938 3791.26
APA1000-BG456M

数据手册

ProASICPLUS 456-BBGA Tray Active Not Verified - - 202752 356 1000000 2.3V ~ 2.7V Surface Mount -55°C ~ 125°C (TC) - - 456-PBGA (35x35)