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制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
M1AGL1000V2-CS281I

M1AGL1000V2-CS281I

IC FPGA 215 I/O 281CSP

Microchip Technology

2,591 138.64
M1AGL1000V2-CS281I

数据手册

IGLOO 281-TFBGA, CSBGA Tray Active Not Verified - 24576 147456 215 1000000 1.14V ~ 1.575V Surface Mount -40°C ~ 85°C (TA) - - 281-CSP (10x10)
A40MX04-3PLG68I

A40MX04-3PLG68I

IC FPGA 57 I/O 68PLCC

Microchip Technology

3,057 137.93
A40MX04-3PLG68I

数据手册

MX 68-LCC (J-Lead) Tray Active Not Verified - - - 57 6000 3V ~ 3.6V, 4.5V ~ 5.5V Surface Mount -40°C ~ 85°C (TA) - - 68-PLCC (24.23x24.23)
U1AFS600-FG256

U1AFS600-FG256

IC FPGA 114 I/O 256FBGA

Microchip Technology

2,388 139.91
U1AFS600-FG256

数据手册

Fusion® 256-LBGA Tray Active Not Verified - - 36864 114 250000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 256-FPBGA (17x17)
U1AFS600-FGG256

U1AFS600-FGG256

IC FPGA 114 I/O 256FBGA

Microchip Technology

1,770 139.91
U1AFS600-FGG256

数据手册

Fusion® 256-LBGA Tray Active Not Verified - - 36864 114 250000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 256-FPBGA (17x17)
M7A3P1000-2PQG208

M7A3P1000-2PQG208

IC FPGA 154 I/O 208QFP

Microchip Technology

1,969 137.58
M7A3P1000-2PQG208

数据手册

ProASIC3 208-BFQFP Tray Active Not Verified - - 147456 154 1000000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 208-PQFP (28x28)
A54SX32A-FFGG256

A54SX32A-FFGG256

IC FPGA 203 I/O 256FBGA

Microchip Technology

4,736 138.89
A54SX32A-FFGG256

数据手册

SX-A 256-BGA Tray Active Not Verified 2880 - - 203 48000 2.25V ~ 5.25V Surface Mount 0°C ~ 70°C (TA) - - 256-FPBGA (17x17)
A54SX32A-FFG256

A54SX32A-FFG256

IC FPGA 203 I/O 256FBGA

Microchip Technology

4,091 138.89
A54SX32A-FFG256

数据手册

SX-A 256-BGA Tray Active Not Verified 2880 - - 203 48000 2.25V ~ 5.25V Surface Mount 0°C ~ 70°C (TA) - - 256-FPBGA (17x17)
A40MX04-3PLG84I

A40MX04-3PLG84I

IC FPGA 69 I/O 84PLCC

Microchip Technology

3,482 139.60
A40MX04-3PLG84I

数据手册

MX 84-LCC (J-Lead) Tray Last Time Buy Not Verified - - - 69 6000 3V ~ 3.6V, 4.5V ~ 5.5V Surface Mount -40°C ~ 85°C (TA) - - 84-PLCC (29.31x29.31)
M1A3P600L-FG484I

M1A3P600L-FG484I

IC FPGA 235 I/O 484FBGA

Microchip Technology

1,654 139.14
M1A3P600L-FG484I

数据手册

ProASIC3L 484-BGA Tray Active Not Verified - - 110592 235 600000 1.14V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 484-FPBGA (23x23)
M1A3P600L-FGG484I

M1A3P600L-FGG484I

IC FPGA 235 I/O 484FBGA

Microchip Technology

2,417 139.14
M1A3P600L-FGG484I

数据手册

ProASIC3L 484-BGA Tray Active Not Verified - - 110592 235 600000 1.14V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 484-FPBGA (23x23)
A54SX16A-2PQG208

A54SX16A-2PQG208

IC FPGA 175 I/O 208QFP

Microchip Technology

4,434 139.50
A54SX16A-2PQG208

数据手册

SX-A 208-BFQFP Tray Active Not Verified 1452 - - 175 24000 2.25V ~ 5.25V Surface Mount 0°C ~ 70°C (TA) - - 208-PQFP (28x28)
A54SX16A-1PQG208I

A54SX16A-1PQG208I

IC FPGA 175 I/O 208QFP

Microchip Technology

2,091 139.50
A54SX16A-1PQG208I

数据手册

SX-A 208-BFQFP Tray Active Not Verified 1452 - - 175 24000 2.25V ~ 5.25V Surface Mount -40°C ~ 85°C (TA) - - 208-PQFP (28x28)
M2GL090-FG484

M2GL090-FG484

IC FPGA 267 I/O 484FBGA

Microchip Technology

1,988 148.14
M2GL090-FG484

数据手册

IGLOO2 484-BGA Tray Active Not Verified - 86316 2648064 267 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)
M2GL090-FGG484

M2GL090-FGG484

IC FPGA 267 I/O 484FBGA

Microchip Technology

4,474 148.14
M2GL090-FGG484

数据手册

IGLOO2 484-BGA Tray Active Not Verified - 86316 2648064 267 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)
M7A3P1000-1FG484

M7A3P1000-1FG484

IC FPGA 300 I/O 484FBGA

Microchip Technology

2,190 139.79
M7A3P1000-1FG484

数据手册

ProASIC3 484-BGA Tray Active Not Verified - - 147456 300 1000000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)
M7A3P1000-1FGG484

M7A3P1000-1FGG484

IC FPGA 300 I/O 484FBGA

Microchip Technology

2,359 139.79
M7A3P1000-1FGG484

数据手册

ProASIC3 484-BGA Tray Active Not Verified - - 147456 300 1000000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)
M7A3P1000-1FGG144I

M7A3P1000-1FGG144I

IC FPGA 97 I/O 144FBGA

Microchip Technology

4,224 139.94
M7A3P1000-1FGG144I

数据手册

ProASIC3 144-LBGA Tray Active Not Verified - - 147456 97 1000000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 144-FPBGA (13x13)
M7A3P1000-1FG144I

M7A3P1000-1FG144I

IC FPGA 97 I/O 144FBGA

Microchip Technology

1,045 139.94
M7A3P1000-1FG144I

数据手册

ProASIC3 144-LBGA Tray Active Not Verified - - 147456 97 1000000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 144-FPBGA (13x13)
M7A3P1000-FG256I

M7A3P1000-FG256I

IC FPGA 177 I/O 256FBGA

Microchip Technology

3,844 140.21
M7A3P1000-FG256I

数据手册

ProASIC3 256-LBGA Tray Active Not Verified - - 147456 177 1000000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 256-FPBGA (17x17)
M7A3P1000-FGG256I

M7A3P1000-FGG256I

IC FPGA 177 I/O 256FBGA

Microchip Technology

4,881 140.21
M7A3P1000-FGG256I

数据手册

ProASIC3 256-LBGA Tray Active Not Verified - - 147456 177 1000000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 256-FPBGA (17x17)